Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6187418 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal +1 more | 2001-02-13 |
| 6139666 | Method for producing ceramic surfaces with easily removable contact sheets | Benjamin V. Fasano, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal | 2000-10-31 |
| 6136419 | Ceramic substrate having a sealed layer | Benjamin V. Fasano, Richard F. Indyk, Sundar M. Kamath, John U. Knickerbocker, Scott I. Langenthal +1 more | 2000-10-24 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2000-09-26 |
| 6068912 | Platible non-metallic filler material for metallurgical screening paste | Donald R. Wall | 2000-05-30 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 1999-07-20 |
| 5869134 | CVD of metals capable of receiving nickel or alloys thereof using iodide | John U. Knickerbocker, Donald R. Wall | 1999-02-09 |
| 5655213 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Govindarajan Natarajan | 1997-08-05 |
| 5639562 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Govindarajan Natarajan | 1997-06-17 |
| 5613181 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Govindarajan Natarajan | 1997-03-18 |
| 5532031 | I/O pad adhesion layer for a ceramic substrate | Shaji Farooq, Sampath Purushothaman, Vivek M. Sura | 1996-07-02 |
| 5525761 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Shaji Farooq, Anthony Mastreani, Rao V. Vallabhaneni | 1996-06-11 |
| 5512711 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Shaji Farooq, Anthony Mastreani, Rao V. Vallabhaneni | 1996-04-30 |
| 5468445 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Jon A. Casey, Renuka S. Divakaruni, Govindarajan Natarajan, Manfred Sammet | 1995-11-21 |
| 5336444 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Jon A. Casey, Renuka S. Divakaruni, Govindarajan Natarajan, Manfred Sammet | 1994-08-09 |
| 5304517 | Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering | Jon A. Casey, Sylvia Marie DeCarr, Subhash L. Shinde, Vivek M. Sura, Rao R. Tummala | 1994-04-19 |
| 5292477 | Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith | Dudley A. Chance, David B. Goland, Subhash L. Shinde, Donald R. Wall | 1994-03-08 |
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5167913 | Method of forming an adherent layer of metallurgy on a ceramic substrate | John Acocella, Philip L. Flaitz, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker +2 more | 1992-12-01 |
| 5139851 | Low dielectric composite substrate | John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more | 1992-08-18 |
| 5139975 | Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates | Lester W. Herron, Sarah H. Knickerbocker, Ananda H. Kumar, Govindarajan Natarajan | 1992-08-18 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |
| 5073180 | Method for forming sealed co-fired glass ceramic structures | Shaji Farooq, Govindarajan Natarajan, Richard A. Shelleman, Nancy Cecelia Stoffel, Rao V. Vallabhaneni | 1991-12-17 |
| 5053361 | Setter tile for use in sintering of ceramic substrate laminates | Lester W. Herron, Sarah H. Knickerbocker, Govindarajan Natarajan | 1991-10-01 |
| 4971738 | Enhanced removal of carbon from ceramic substrate laminates | Lester W. Herron, Sarah H. Knickerbocker, Ananda H. Kumar, Govindarajan Natarajan | 1990-11-20 |