Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5292477 | Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith | David B. Goland, Srinivasa S. N. Reddy, Subhash L. Shinde, Donald R. Wall | 1994-03-08 |
| 5245136 | Hermetic package for an electronic device | David B. Goland, Ho-Ming Tong | 1993-09-14 |
| 5194196 | Hermetic package for an electronic device and method of manufacturing same | David B. Goland, Ho-Ming Tong | 1993-03-16 |
| 5177594 | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance | Evan E. Davidson, Timothy R. Dinger, David B. Goland, David Paul LaPotin | 1993-01-05 |
| 5169310 | Hermetic package for an electronic device and method of manufacturing same | David B. Goland, Ho-Ming Tong | 1992-12-08 |
| 5157477 | Matched impedance vertical conductors in multilevel dielectric laminated wiring | — | 1992-10-20 |
| 5155577 | Integrated circuit carriers and a method for making engineering changes in said carriers | Timothy R. Dinger, David Paul LaPotin, Walter V. Vilkelis | 1992-10-13 |
| 5147484 | Method for producing multi-layer ceramic substrates with oxidation resistant metalization | Gareth G. Hougham, David B. Goland | 1992-09-15 |
| 4870539 | Doped titanate glass-ceramic for grain boundary barrier layer capacitors | Yung-Haw Hu | 1989-09-26 |
| 4555285 | Forming patterns in metallic or ceramic substrates | Timothy C. Reiley, Michael Sampogna | 1985-11-26 |
| 4539576 | Electrolytic printing head | Michael Sampogna | 1985-09-03 |
| 4489364 | Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface | Alan Platt, Chung W. Ho, Sudipta K. Ray | 1984-12-18 |
| 4463059 | Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding | Somnath Bhattacharya, Nicholas G. Koopman, Sudipta K. Ray | 1984-07-31 |
| 4453176 | LSI Chip carrier with buried repairable capacitor with low inductance leads | Gerard V. Kopcsay | 1984-06-05 |
| 4430690 | Low inductance MLC capacitor with metal impregnation and solder bar contact | Chung W. Ho, Timothy C. Reiley | 1984-02-07 |
| 4352184 | Gas laser and method of manufacturing | — | 1982-09-28 |
| 4349862 | Capacitive chip carrier and multilayer ceramic capacitors | Christopher H. Bajorek, Chung W. Ho | 1982-09-14 |
| 4328530 | Multiple layer, ceramic carrier for high switching speed VLSI chips | Christopher H. Bajorek, Chung W. Ho, David A. Thompson | 1982-05-04 |