Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9992357 | Authentication of a print request | Prashant Asthana | 2018-06-05 |
| 4514751 | Compressively stresses titanium metallurgy for contacting passivated semiconductor devices | — | 1985-04-30 |
| 4463059 | Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding | Dudley A. Chance, Nicholas G. Koopman, Sudipta K. Ray | 1984-07-31 |
| 4434434 | Solder mound formation on substrates | Shih-Ming Hu, Nicholas G. Koopman, Chester C. Oldakowski | 1984-02-28 |