| 6268238 |
Three dimensional package and architecture for high performance computer |
David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski |
2001-07-31 |
| 5935687 |
Three dimensional package and architecture for high performance computer |
David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski |
1999-08-10 |
| 5817986 |
Three dimensional package and architecture for high performance computer |
David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski |
1998-10-06 |
| 5639163 |
On-chip temperature sensing system |
Francis Edward Bosco, Charles Vakirtzis |
1997-06-17 |
| 5495397 |
Three dimensional package and architecture for high performance computer |
David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski |
1996-02-27 |
| 5177594 |
Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
Dudley A. Chance, Timothy R. Dinger, David B. Goland, David Paul LaPotin |
1993-01-05 |
| 4644265 |
Noise reduction during testing of integrated circuit chips |
David Kiesling |
1987-02-17 |
| 4398106 |
On-chip Delta-I noise clamping circuit |
George A. Katopis, Barry J. Rubin |
1983-08-09 |
