Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6268238 | Three dimensional package and architecture for high performance computer | David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski | 2001-07-31 |
| 5935687 | Three dimensional package and architecture for high performance computer | David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski | 1999-08-10 |
| 5817986 | Three dimensional package and architecture for high performance computer | David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski | 1998-10-06 |
| 5639163 | On-chip temperature sensing system | Francis Edward Bosco, Charles Vakirtzis | 1997-06-17 |
| 5495397 | Three dimensional package and architecture for high performance computer | David Lewis, Jane M. Shaw, Alfred Viehbeck, Janusz S. Wilczynski | 1996-02-27 |
| 5177594 | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance | Dudley A. Chance, Timothy R. Dinger, David B. Goland, David Paul LaPotin | 1993-01-05 |
| 4644265 | Noise reduction during testing of integrated circuit chips | David Kiesling | 1987-02-17 |
| 4398106 | On-chip Delta-I noise clamping circuit | George A. Katopis, Barry J. Rubin | 1983-08-09 |