Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652956 | X-ray printing personalization technique | Lawrence A. Clevenger, Louis L. Hsu, Joseph F. Shepard, Jr., Subhash L. Shinde | 2003-11-25 |
| 6638681 | X-ray printing personalization technique | Lawrence A. Clevenger, Louis L. Hsu, Joseph F. Shepard, Jr., Subhash L. Shinde | 2003-10-28 |
| 6373133 | Multi-chip module and heat-sink cap combination | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 2002-04-16 |
| 6352014 | Method for making punches using multi-layer ceramic technology | David C. Long, John U. Knickerbocker, Subhash L. Shinde | 2002-03-05 |
| 6306528 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Lester W. Herron +4 more | 2001-10-23 |
| 6262390 | Repair process for aluminum nitride substrates | Mark J. LaPlante, David C. Long, Dale Curtis McHerron, Krishna G. Sachdev, Subhash L. Shinde | 2001-07-17 |
| 6200373 | Method for controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Lester W. Herron +4 more | 2001-03-13 |
| 6096565 | Multi-layer glass ceramic module with superconductor wiring | Richard A. Shelleman, Subhash L. Shinde, Lisa M. Studzinski, Rao V. Vallabhaneni | 2000-08-01 |
| 6004624 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Lester W. Herron +4 more | 1999-12-21 |
| 6002951 | Multi-layer ceramic substrate having high TC superconductor circuitry | Richard A. Shelleman, Subhash L. Shinde, Lisa M. Studzinski, Rao V. Vallabhaneni | 1999-12-14 |
| 5981310 | Multi-chip heat-sink cap assembly | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 1999-11-09 |
| 5932043 | Method for flat firing aluminum nitride/tungsten electronic modules | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Lester W. Herron +4 more | 1999-08-03 |
| 5891543 | Apparatus and method for screening using electrostatic adhesion | Jon A. Casey, Cynthia J. Calli, Darren T. Cook, John U. Knickerbocker, Mark J. LaPlante +8 more | 1999-04-06 |
| 5763093 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Jonathan H. Harris +7 more | 1998-06-09 |
| 5759669 | Apparatus and method for screening green sheet with via hole using porous backing material | Jon A. Casey, Cynthia J. Calli, Darren T. Cook, John U. Knickerbocker, Mark J. LaPlante +8 more | 1998-06-02 |
| 5682589 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Jonathan H. Harris +7 more | 1997-10-28 |
| 5635000 | Method for screening using electrostatic adhesion | Jon A. Casey, Cynthia J. Calli, Darren T. Cook, John U. Knickerbocker, Mark J. LaPlante +8 more | 1997-06-03 |
| 5552107 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Jonathan H. Harris +7 more | 1996-09-03 |
| 5552232 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, Robert Hannon, Jonathan H. Harris +7 more | 1996-09-03 |
| 5480503 | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Jon A. Casey, Dinesh Gupta, Lester W. Herron, James N. Humenik, Thomas E. Lombardi +3 more | 1996-01-02 |
| 5292477 | Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith | Dudley A. Chance, Srinivasa S. N. Reddy, Subhash L. Shinde, Donald R. Wall | 1994-03-08 |
| 5245136 | Hermetic package for an electronic device | Dudley A. Chance, Ho-Ming Tong | 1993-09-14 |
| 5194196 | Hermetic package for an electronic device and method of manufacturing same | Dudley A. Chance, Ho-Ming Tong | 1993-03-16 |
| 5177594 | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance | Dudley A. Chance, Evan E. Davidson, Timothy R. Dinger, David Paul LaPotin | 1993-01-05 |
| 5169310 | Hermetic package for an electronic device and method of manufacturing same | Dudley A. Chance, Ho-Ming Tong | 1992-12-08 |