Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170337 | Implant after through-silicon via (TSV) etch to getter mobile ions | Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Brian J. Greene, Herbert L. Ho +1 more | 2019-01-01 |
| 9642346 | Fishing line guide system | — | 2017-05-09 |
| 9406561 | Three dimensional integrated circuit integration using dielectric bonding first and through via formation last | Mukta G. Farooq, Subramanian S. Iyer, Emily R. Kinser | 2016-08-02 |
| D726866 | Fishing line guide | — | 2015-04-14 |
| 8962448 | Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2015-02-24 |
| 8921198 | Method and structure for forming a deep trench capacitor | Roger A. Booth, Jr., Kangguo Cheng, Ravi M. Todi, Geng Wang | 2014-12-30 |
| 8822141 | Front side wafer ID processing | Mukta G. Farooq, Subramanian S. Iyer, Kevin S. Petrarca, Stuart A. Sieg | 2014-09-02 |
| 8738167 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman, Roy R. Yu | 2014-05-27 |
| 8679971 | Metal-contamination-free through-substrate via structure | Mukta G. Farooq, Richard P. Volant | 2014-03-25 |
| 8664081 | Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2014-03-04 |
| 8658535 | Optimized annular copper TSV | Paul S. Andry, Mukta G. Rarooq, Subramanian S. Iyer, Emily R. Kinser, Comelia K. Tsang +1 more | 2014-02-25 |
| 8629553 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman, Roy R. Yu | 2014-01-14 |
| 8546961 | Alignment marks to enable 3D integration | Mukta G. Farooq, Troy L. Graves-Abe, Emily R. Kinser, William Francis Landers, Kevin S. Petrarca +2 more | 2013-10-01 |
| 8492869 | 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2013-07-23 |
| 8492878 | Metal-contamination-free through-substrate via structure | Mukta G. Farooq, Richard P. Volant | 2013-07-23 |
| 8487425 | Optimized annular copper TSV | Paul S. Andry, Mukta G. Farooq, Subramanian S. Iyer, Emily R. Kinser, Cornelia K. Tsang +1 more | 2013-07-16 |
| D685056 | Fishing line guide | — | 2013-06-25 |
| 8455270 | 3D multiple die stacking | Mukta G. Farooq, Subramanian S. Iyer | 2013-06-04 |
| 8399336 | Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2013-03-19 |
| 8372725 | Structures and methods of forming pre fabricated deep trench capacitors for SOI substrates | Subramanian S. Iyer, Gerd Pfeiffer, Ravi M. Todi, Kevin R. Winstel | 2013-02-12 |
| 8298914 | 3D integrated circuit device fabrication using interface wafer as permanent carrier | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2012-10-30 |
| 8129256 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman, Roy R. Yu | 2012-03-06 |
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Ian D. Melville | 2011-12-13 |
| 8022543 | Underbump metallurgy for enhanced electromigration resistance | Mukta G. Farooq, Emily R. Kinser, Ian D. Melville | 2011-09-20 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Ian D. Melville | 2011-06-07 |