Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136655 | Backside electrical contacts to buried power rails | Ruilong Xie, Brent A. Anderson, Albert M. Young, Kangguo Cheng, Julien Frougier +2 more | 2024-11-05 |
| 12106969 | Substrate thinning for a backside power distribution network | Ruilong Xie, Balasubramanian Pranatharthiharan, Mukta G. Farooq, Julien Frougier, Takeshi Nogami +1 more | 2024-10-01 |
| 12002758 | Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer | Ruilong Xie, Takeshi Nogami, Balasubramanian Pranatharthiharan, Chih-Chao Yang | 2024-06-04 |
| 11915966 | Backside power rail integration | Ruilong Xie, Takeshi Nogami, Balasubramanian Pranatharthiharan, Albert M. Young, Kisik Choi +1 more | 2024-02-27 |
| 9171742 | Alignment of integrated circuit chip stack | Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth F. Latzko +4 more | 2015-10-27 |
| 8962448 | Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2015-02-24 |
| 8738167 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman | 2014-05-27 |
| 8664081 | Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2014-03-04 |
| 8629553 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman | 2014-01-14 |
| 8546188 | Bow-balanced 3D chip stacking | Fei Liu, Albert M. Young | 2013-10-01 |
| 8492869 | 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2013-07-23 |
| 8399336 | Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2013-03-19 |
| 8298914 | 3D integrated circuit device fabrication using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2012-10-30 |
| 8129256 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman | 2012-03-06 |
| 6339527 | Thin film capacitor on ceramic | Mukta S. Farooq, John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita | 2002-01-15 |