Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7608295 | Polyimide compositions and use thereof in ceramic product defect repair | Krishna G. Sachdev, Michael Berger, Gregg B. Monjeau, Kathleen M. Wiley | 2009-10-27 |
| 7387838 | Low loss glass-ceramic materials, method of making same and electronic packages including same | — | 2008-06-17 |
| 7294909 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2007-11-13 |
| 7186461 | Glass-ceramic materials and electronic packages including same | — | 2007-03-06 |
| 6943108 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | Mukta G. Farooq, John U. Knickerbocker, Srinivasa S. N. Reddy | 2005-09-13 |
| 6916670 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more | 2005-07-12 |
| 6823585 | Method of selective plating on a substrate | Mark J. LaPlante, Jon A. Casey, Thomas A. Wassick, David C. Long, Krystyna W. Semkow +8 more | 2004-11-30 |
| 6791133 | Interposer capacitor built on silicon wafer and joined to a ceramic substrate | Mukta G. Farooq, John U. Knickerbocker, Srinivasa S. N. Reddy | 2004-09-14 |
| 6713686 | Apparatus and method for repairing electronic packages | Wiren D. Becker, Dinesh Gupta, Sudipta K. Ray, Herbert I. Stoller, Kathleen M. Wiley | 2004-03-30 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste | Jon A. Casey, Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long +2 more | 2002-11-05 |
| 6461493 | Decoupling capacitor method and structure using metal based carrier | Mukta S. Farooq, Shaji Farooq, John U. Knickerbocker, Srinivasa N. Reddy | 2002-10-08 |
| 6436332 | Low loss glass ceramic composition with modifiable dielectric constant | Benjamin V. Fasano | 2002-08-20 |
| 6430030 | High k dielectric material with low k dielectric sheathed signal vias | Mukta S. Farooq, Harvey C. Hamel, Herbert I. Stoller | 2002-08-06 |
| 6413339 | Low temperature sintering of ferrite materials | Govindarajan Natarajan, Jon A. Casey, Martin Klepeis, John U. Knickerbocker, Srinivasa S. N. Reddy +1 more | 2002-07-02 |
| 6339527 | Thin film capacitor on ceramic | Mukta S. Farooq, John U. Knickerbocker, Srinivasa S. N. Reddy, Roy R. Yu | 2002-01-15 |
| 6285080 | Planar metallized substrate with embedded camber control material and method thereof | Raschid J. Bezama, Kenneth A. Bird, Alan Piciacchio | 2001-09-04 |
| 6254925 | Source metal embedded in an inert material and process thereof | Govindarajan Natarajan, John U. Knickerbocker | 2001-07-03 |
| 6231707 | Method of forming a multilayer ceramic substrate with max-punched vias | Dinesh Gupta, L. Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak | 2001-05-15 |
| 6216324 | Method for a thin film multilayer capacitor | Mukta S. Farooq, Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Herbert I. Stoller | 2001-04-17 |
| 6210545 | Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target | Mukta S. Farooq, Stephen M. Rossnagel | 2001-04-03 |
| 6200400 | Method for making high k dielectric material with low k dielectric sheathed signal vias | Mukta S. Farooq, Harvey C. Hamel, Herbert I. Stoller | 2001-03-13 |
| 6178082 | High temperature, conductive thin film diffusion barrier for ceramic/metal systems | Mukta S. Farooq, David E. Kotecki, Stephen M. Rossnagel | 2001-01-23 |
| 6171988 | Low loss glass ceramic composition with modifiable dielectric constant | Benjamin V. Fasano | 2001-01-09 |
| 6117367 | Pastes for improved substrate dimensional control | Raschid J. Bezama, Michael A. Cohn, Benjamin V. Fasano, Gregory M. Johnson, Rao V. Vallabhaneni +1 more | 2000-09-12 |
| 6072690 | High k dielectric capacitor with low k sheathed signal vias | Mukta S. Farooq, Harvey C. Hamel, Herbert I. Stoller | 2000-06-06 |