Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6984792 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2006-01-10 |
| 6574859 | Interconnection process for module assembly and rework | Mario J. Interrante, Sudipta K. Ray, William E. Sablinski | 2003-06-10 |
| 6559527 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2003-05-06 |
| 6528145 | Polymer and ceramic composite electronic substrates | Daniel G. Berger, Lester W. Herron, James N. Humenik, John U. Knickerbocker, Robert W. Pasco +2 more | 2003-03-04 |
| 6461493 | Decoupling capacitor method and structure using metal based carrier | Mukta S. Farooq, John U. Knickerbocker, Robert A. Rita, Srinivasa N. Reddy | 2002-10-08 |
| 6444496 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | David L. Edwards, Glenn G. Daves, Sushumna Iruvanti, Frank L. Pompeo | 2002-09-03 |
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Lester W. Herron, Hal Mitchell Lasky +6 more | 2002-03-19 |
| 6333563 | Electrical interconnection package and method thereof | Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq +3 more | 2001-12-25 |
| 6300164 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Stephen A. DeLaurentis, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter | 2001-10-09 |
| 6297559 | Structure, materials, and applications of ball grid array interconnections | Anson J. Call, Stephen A. DeLaurentis, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter | 2001-10-02 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more | 2001-09-04 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | David L. Edwards, Glenn G. Daves, Sushumna Iruvanti, Frank L. Pompeo | 2001-08-14 |
| 6271111 | High density pluggable connector array and process thereof | Suryanarayana Kaja, Li-Kong Wang | 2001-08-07 |
| 6235996 | Interconnection structure and process module assembly and rework | Mario J. Interrante, Sudipta K. Ray, William E. Sablinski | 2001-05-22 |
| 6216324 | Method for a thin film multilayer capacitor | Mukta S. Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita, Herbert I. Stoller | 2001-04-17 |
| 6184062 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter | 2001-02-06 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more | 2000-12-12 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Lester W. Herron, Hal Mitchell Lasky +6 more | 2000-09-26 |
| 6120885 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Stephen A. DeLaurentis, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter | 2000-09-19 |
| 6023407 | Structure for a thin film multilayer capacitor | Mukta S. Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita, Herbert I. Stoller | 2000-02-08 |
| 5985128 | Method of performing processes on features with electricity | Suryanarayana Kaja, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing | 1999-11-16 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-11-02 |
| 5977625 | Semiconductor package with low strain seal | David L. Edwards, Raed A. Sherif, Hilton T. Toy, Patrick A. Coico | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, Lewis S. Goldmann +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-10-12 |