Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6984792 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray | 2006-01-10 |
| 6657313 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Faroon, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray | 2003-12-02 |
| 6584684 | Method for assembling a carrier and a semiconductor device | Peter J. Brofman, Anson J. Call, Jeffrey T. Coffin | 2003-07-01 |
| 6559527 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray | 2003-05-06 |
| 6548909 | Method of interconnecting electronic components using a plurality of conductive studs | Peter J. Brofman, Sudipta K. Ray | 2003-04-15 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Sudipta K. Ray | 2002-03-26 |
| 6300164 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman | 2001-10-09 |
| 6297559 | Structure, materials, and applications of ball grid array interconnections | Anson J. Call, Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman | 2001-10-02 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more | 2001-09-04 |
| 6278184 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2001-08-21 |
| 6270363 | Z-axis compressible polymer with fine metal matrix suspension | Peter J. Brofman, John U. Knickerbocker, Sudipta K. Ray | 2001-08-07 |
| 6258625 | Method of interconnecting electronic components using a plurality of conductive studs | Peter J. Brofman, Sudipta K. Ray | 2001-07-10 |
| 6253986 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2001-07-03 |
| 6220499 | Method for assembling a chip carrier to a semiconductor device | Peter J. Brofman, Shaji Faroog, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray | 2001-04-24 |
| 6216937 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Sudipta K. Ray | 2001-04-17 |
| 6218629 | Module with metal-ion matrix induced dendrites for interconnection | Peter J. Brofman, Anson J. Call, Jeffrey T. Coffin | 2001-04-17 |
| 6184062 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray | 2001-02-06 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more | 2000-12-12 |
| 6120885 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman | 2000-09-19 |
| 6070321 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2000-06-06 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, Shaji Farooq +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more | 1999-10-12 |