Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492199 | Reworkable underfills for ceramic MCM C4 protection | Steven P. Ostrander, Frank L. Pompeo, Jiali Wu | 2013-07-23 |
| 8037594 | Method of forming a flip-chip package | Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2011-10-18 |
| 7489512 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2009-02-10 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2008-01-15 |
| 6740959 | EMI shielding for semiconductor chip carriers | David J. Alcoe, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante, Brenda Peterson +6 more | 2004-05-25 |
| 6584684 | Method for assembling a carrier and a semiconductor device | Peter J. Brofman, Anson J. Call, Kathleen A. Stalter | 2003-07-01 |
| 6462271 | Capping structure for electronics package undergoing compressive socket actuation | Michael J. Ellsworth, Jr., Lewis S. Goldmann, John G. Torok | 2002-10-08 |
| 6413353 | Method for direct attachment of a chip to a cooling member | Frank L. Pompeo, Alain Caron, Jeffrey A. Zitz | 2002-07-02 |
| 6218629 | Module with metal-ion matrix induced dendrites for interconnection | Peter J. Brofman, Anson J. Call, Kathleen A. Stalter | 2001-04-17 |
| 5990418 | Hermetic CBGA/CCGA structure with thermal paste cooling | Kevin G. Bivona, Stephen S. Drofitz, Jr., Lewis S. Goldmann, Mario J. Interrante, Sushumna Iruvanti +1 more | 1999-11-23 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | David L. Edwards, Armando S. Cammarano, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more | 1999-03-16 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | David L. Edwards, Armando S. Cammarano, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr. +6 more | 1999-03-16 |
| 5049201 | Method of inhibiting corrosion in an electronic package | Shirley N. Cheng, Constance J. Araps, Allen J. Arnold, Luu Thanh Nguyen | 1991-09-17 |