Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7972178 | High density connector for interconnecting fine pitch circuit packaging structures | Benson Chan | 2011-07-05 |
| 7851906 | Flexible circuit electronic package with standoffs | Varaprasad V. Calmidi | 2010-12-14 |
| 7629684 | Adjustable thickness thermal interposer and electronic package utilizing same | Varaprasad V. Calmidi | 2009-12-08 |
| 7213336 | Hyperbga buildup laminate | Kim J. Blackwell | 2007-05-08 |
| 7186590 | Thermally enhanced lid for multichip modules | William L. Brodsky, Varaprasad V. Calmidi, Sanjeev Sathe, Randall J. Stutzman | 2007-03-06 |
| 7109732 | Electronic component test apparatus | — | 2006-09-19 |
| 7087846 | Pinned electronic package with strengthened conductive pad | — | 2006-08-08 |
| 7088008 | Electronic package with optimized circuitization pattern | William Infantolino, Virendra R. Jadhav | 2006-08-08 |
| 7014094 | Method of reforming reformable members of an electronic package and the resultant electronic package | — | 2006-03-21 |
| 7015574 | Electronic device carrier adapted for transmitting high frequency signals | Ronald Peter Nowak, Francesco Preda, Stefano S. Oggioni | 2006-03-21 |
| 6992379 | Electronic package having a thermal stretching layer | Li Li, Sanjeev Sathe | 2006-01-31 |
| 6978542 | Method of reforming reformable members of an electronic package and the resultant electronic package | — | 2005-12-27 |
| 6949415 | Module with adhesively attached heat sink | Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman | 2005-09-27 |
| 6887779 | Integrated circuit structure | Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki | 2005-05-03 |
| 6879492 | Hyperbga buildup laminate | Kim J. Blackwell | 2005-04-12 |
| 6830960 | Stress-relieving heatsink structure and method of attachment to an electronic package | Randall J. Stutzman | 2004-12-14 |
| 6816385 | Compliant laminate connector | — | 2004-11-09 |
| 6815837 | Electronic package with strengthened conductive pad | — | 2004-11-09 |
| 6744132 | Module with adhesively attached heat sink | Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman | 2004-06-01 |
| 6740959 | EMI shielding for semiconductor chip carriers | Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante, Brenda Peterson +6 more | 2004-05-25 |
| 6720502 | Integrated circuit structure | Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki | 2004-04-13 |
| 6703704 | Stress reducing stiffener ring | Kim J. Blackwell, Virendra R. Jadhav | 2004-03-09 |
| 6667557 | Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections | Eric A. Johnson, Matthew Reiss, Charles G. Woychik | 2003-12-23 |
| 6665187 | Thermally enhanced lid for multichip modules | William L. Brodsky, Varaprasad V. Calmidi, Sanjeev Sathe, Randall J. Stutzman | 2003-12-16 |
| 6654250 | Low-stress compressive heatsink structure | — | 2003-11-25 |