Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6989607 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers | Krishna Darbha, Miguel A. Jimarez, Sanjeev Sathe, Charles G. Woychik | 2006-01-24 |
| 6667557 | Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections | David J. Alcoe, Eric A. Johnson, Charles G. Woychik | 2003-12-23 |
| 6639302 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Krishna Darbha, Miguel A. Jimarez, Sanjeev Sathe, Charles G. Woychik | 2003-10-28 |
| 6570259 | Apparatus to reduce thermal fatigue stress on flip chip solder connections | David J. Alcoe, Eric A. Johnson, Charles G. Woychik | 2003-05-27 |