| 7510324 |
Method of inspecting articles using imaging inspection apparatus with directional cooling |
Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr. |
2009-03-31 |
|
| 7510912 |
Method of making wirebond electronic package with enhanced chip pad design |
David V. Caletka, Varaprasad V. Calmidi |
2009-03-31 |
|
| 7490984 |
Method of making an imaging inspection apparatus with improved cooling |
Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr. |
2009-02-17 |
|
| 7354197 |
Imaging inspection apparatus with improved cooling |
Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr. |
2008-04-08 |
|
| 7348261 |
Wafer scale thin film package |
David V. Caletka, Seungbae Park |
2008-03-25 |
$5,860,000 |
| 7261466 |
Imaging inspection apparatus with directional cooling |
Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr. |
2007-08-28 |
|
| 7253518 |
Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same |
David V. Caletka, Varaprasad V. Calmidi |
2007-08-07 |
|
| 7186590 |
Thermally enhanced lid for multichip modules |
David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Randall J. Stutzman |
2007-03-06 |
$6,019,000 |
| 7183642 |
Electronic package with thermally-enhanced lid |
Anandaroop Bhattacharya, Varaprasad V. Calmidi |
2007-02-27 |
$7,582,000 |
| 7037753 |
Non-planar surface for semiconductor chips |
William L. Brodsky, George H. Thiel |
2006-05-02 |
$4,743,000 |
| 7026706 |
Method and packaging structure for optimizing warpage of flip chip organic packages |
William Infantolino, Li Li, Steven G. Rosser |
2006-04-11 |
$11,292,000 |
| 6992379 |
Electronic package having a thermal stretching layer |
David J. Alcoe, Li Li |
2006-01-31 |
$6,009,000 |
| 6989607 |
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers |
Krishna Darbha, Miguel A. Jimarez, Matthew Reiss, Charles G. Woychik |
2006-01-24 |
$7,705,000 |
| 6967389 |
Wafer with semiconductor chips mounted thereon |
William Infantolino, Voya R. Markovich, George H. Thiel |
2005-11-22 |
$6,353,000 |
| 6788859 |
Laminate substrate containing fiber optic cables |
Voya R. Markovich, Sandeep B. Sane |
2004-09-07 |
$9,920,000 |
| 6759270 |
Semiconductor chip module and method of manufacture of same |
William Infantolino, Voya R. Markovich, George H. Thiel |
2004-07-06 |
$6,814,000 |
| 6756662 |
Semiconductor chip module and method of manufacture of same |
William Infantolino, Voya R. Markovich, George H. Thiel |
2004-06-29 |
$8,425,000 |
| 6747331 |
Method and packaging structure for optimizing warpage of flip chip organic packages |
William Infantolino, Li Li, Steven G. Rosser |
2004-06-08 |
$6,083,000 |
| 6731012 |
Non-planar surface for semiconductor chips |
William L. Brodsky, George H. Thiel |
2004-05-04 |
$7,309,000 |
| 6665187 |
Thermally enhanced lid for multichip modules |
David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Randall J. Stutzman |
2003-12-16 |
$6,455,000 |
| 6639302 |
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries |
Krishna Darbha, Miguel A. Jimarez, Matthew Reiss, Charles G. Woychik |
2003-10-28 |
$14,845,000 |
| 6631078 |
Electronic package with thermally conductive standoff |
David J. Alcoe, Varaprasad V. Calmidi, Krishna Darbha |
2003-10-07 |
$18,520,000 |
| 6627998 |
Wafer scale thin film package |
David V. Caletka, Seungbae Park |
2003-09-30 |
$10,221,000 |
| 6622786 |
Heat sink structure with pyramidic and base-plate cut-outs |
Varaprasad V. Calmidi, Krishna Darbha, Jamil A. Wakil |
2003-09-23 |
$14,600,000 |
| 6347901 |
Solder interconnect techniques |
Seungbae Park, Aleksander Zubelewicz |
2002-02-19 |
$18,993,000 |
