Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7088008 | Electronic package with optimized circuitization pattern | David J. Alcoe, Virendra R. Jadhav | 2006-08-08 |
| 7026706 | Method and packaging structure for optimizing warpage of flip chip organic packages | Li Li, Steven G. Rosser, Sanjeev Sathe | 2006-04-11 |
| 6967389 | Wafer with semiconductor chips mounted thereon | Voya R. Markovich, Sanjeev Sathe, George H. Thiel | 2005-11-22 |
| 6905961 | Land grid array stiffener for use with flexible chip carriers | David V. Caletka, Krishna Darbha, Eric A. Johnson | 2005-06-14 |
| 6759270 | Semiconductor chip module and method of manufacture of same | Voya R. Markovich, Sanjeev Sathe, George H. Thiel | 2004-07-06 |
| 6756662 | Semiconductor chip module and method of manufacture of same | Voya R. Markovich, Sanjeev Sathe, George H. Thiel | 2004-06-29 |
| 6747331 | Method and packaging structure for optimizing warpage of flip chip organic packages | Li Li, Steven G. Rosser, Sanjeev Sathe | 2004-06-08 |
| 6528892 | Land grid array stiffener use with flexible chip carriers | David V. Caletka, Krishna Darbha, Eric A. Johnson | 2003-03-04 |
| 6433283 | Dual purpose ribbon cable | William L. Brodsky, David V. Caletka | 2002-08-13 |
| 6268567 | Dual purpose ribbon cable | William L. Brodsky, David V. Caletka | 2001-07-31 |
| 6014031 | Apparatus for pressing an electronic card against contacts of a test socket | — | 2000-01-11 |