Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10914535 | Integrated multi-chamber heat exchanger | David L. Vos, Ryan M. Alderfer | 2021-02-09 |
| 10461018 | Integrated multi-chamber heat exchanger | David L. Vos, Ryan M. Alderfer | 2019-10-29 |
| 10371462 | Integrated multi-chamber heat exchanger | David L. Vos, Ryan M. Alderfer | 2019-08-06 |
| 9357670 | Efficient heat transfer from conduction-cooled circuit cards | Charles H. Dando, III, Clint Long | 2016-05-31 |
| 7324336 | Flow through cooling assemblies for conduction-cooled circuit modules | David L. Vos, Jon Larcheveque, Eugene J. Urda | 2008-01-29 |
| 7186590 | Thermally enhanced lid for multichip modules | David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev Sathe | 2007-03-06 |
| 6949415 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes | 2005-09-27 |
| 6883593 | Heat sink for convection cooling in horizontal applications | Eric A. Johnson | 2005-04-26 |
| 6830960 | Stress-relieving heatsink structure and method of attachment to an electronic package | David J. Alcoe | 2004-12-14 |
| 6829144 | Flip chip package with heat spreader allowing multiple heat sink attachment | Jamil A. Wakil | 2004-12-07 |
| 6793123 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Jamil A. Wakil | 2004-09-21 |
| 6744132 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes | 2004-06-01 |
| 6740959 | EMI shielding for semiconductor chip carriers | David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante +6 more | 2004-05-25 |
| 6691769 | Heat sink for convection cooling in horizontal applications | Eric A. Johnson | 2004-02-17 |
| 6675852 | Platen for use in laminating press | Varaprasad V. Calmidi, Donald S. Farquhar, Michael Joseph Klodowski | 2004-01-13 |
| 6665186 | Liquid metal thermal interface for an electronic module | Varaprasad V. Calmidi, Eric A. Johnson | 2003-12-16 |
| 6665187 | Thermally enhanced lid for multichip modules | David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev Sathe | 2003-12-16 |
| 6655020 | Method of packaging a high performance chip | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, George H. Thiel | 2003-12-02 |
| 6552264 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, George H. Thiel | 2003-04-22 |
| 6552266 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, George H. Thiel | 2003-04-22 |
| 6541847 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Jamil A. Wakil | 2003-04-01 |
| 6455924 | Stress-relieving heatsink structure and method of attachment to an electronic package | David J. Alcoe | 2002-09-24 |
| 6235994 | Thermal/electrical break for printed circuit boards | Bruce J. Chamberlin, Mitchell G. Ferrill, George H. Thiel | 2001-05-22 |
| 6212076 | Enhanced heat-dissipating printed circuit board package | Stephen W. MacQuarrie, Jerzy M. Zalesinski | 2001-04-03 |
| 5251095 | Low temperature conduction module for a cryogenically-cooled processor | William C. Miller, Russell N. Smith | 1993-10-05 |