Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7394268 | Carrier for test, burn-in, and first level packaging | Claude L. Bertin, Wayne F. Ellis, Mark W. Kellogg, William R. Tonti, James M. Leas +1 more | 2008-07-01 |
| 7196908 | Dual pitch contact pad footprint for flip-chip chips and modules | Timothy W. Budell, David B. Stone | 2007-03-27 |
| 7132841 | Carrier for test, burn-in, and first level packaging | Claude L. Bertin, Wayne F. Ellis, Mark W. Kellogg, William R. Tonti, James M. Leas +1 more | 2006-11-07 |
| 6943452 | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality | Claude L. Bertin, Gordon A. Kelley, Jr., Dennis Arthur Schmidt, William R. Tonti | 2005-09-13 |
| 6816374 | High efficiency heat sink/air cooler system for heat-generating components | Janak G. Patel | 2004-11-09 |
| 6793500 | Radial contact pad footprint and wiring for electrical components | Timothy W. Budell, Esmaeil Rahmati, David B. Stone | 2004-09-21 |
| 6541837 | Charge-coupled device wafer cover plate with compact interconnect wiring | William R. Tonti, Claude L. Bertin, Albert Kao | 2003-04-01 |
| 6410431 | Through-chip conductors for low inductance chip-to-chip integration and off-chip connections | Claude L. Bertin, Wayne J. Howell, William R. Tonti | 2002-06-25 |
| 6388198 | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality | Claude L. Bertin, Gordon A. Kelley, Jr., Dennis Arthur Schmidt, William R. Tonti | 2002-05-14 |
| 6358627 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more | 2002-03-19 |
| 6319745 | Formation of charge-coupled-device with image pick-up array | Claude L. Bertin, William R. Tonti | 2001-11-20 |
| 6255208 | Selective wafer-level testing and burn-in | William E. Bernier, Claude L. Bertin, Anilkumar C. Bhatt, Michael A. Gaynes, Erik L. Hedberg +5 more | 2001-07-03 |
| 6236115 | High density integrated circuit packaging with chip stacking and via interconnections | Michael A. Gaynes, Alan J. Emerick, Viswanadham Puligandla, Charles G. Woychik | 2001-05-22 |
| 6222276 | Through-chip conductors for low inductance chip-to-chip integration and off-chip connections | Claude L. Bertin, Wayne J. Howell, William R. Tonti | 2001-04-24 |
| 6212076 | Enhanced heat-dissipating printed circuit board package | Stephen W. MacQuarrie, Randall J. Stutzman | 2001-04-03 |
| 6187678 | High density integrated circuit packaging with chip stacking and via interconnections | Michael A. Gaynes, Alan J. Emerick, Viswanadham Puligandla, Charles G. Woychik | 2001-02-13 |
| 6177729 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more | 2001-01-23 |
| 6025992 | Integrated heat exchanger for memory module | Richard Dodge, Kenneth Haskell Earl, Gary D. Grise, Douglas R. Guild, Karl D. Loughner | 2000-02-15 |
| 6002177 | High density integrated circuit packaging with chip stacking and via interconnections | Michael A. Gaynes, Alan J. Emerick, Viswanadham Puligandla, Charles G. Woychik | 1999-12-14 |
| 5969945 | Electronic package assembly | Lawrence R. Cutting, Michael A. Gaynes, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins +2 more | 1999-10-19 |
| 5831828 | Flexible circuit board and common heat spreader assembly | Lawrence R. Cutting, Michael A. Gaynes, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins +2 more | 1998-11-03 |
| 5773362 | Method of manufacturing an integrated ULSI heatsink | William R. Tonti, Jack A. Mandelman, Toshiharu Furukawa, Son V. Nguyen, Dureseti Chidambarrao | 1998-06-30 |
| 5759269 | Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture | Lawrence R. Cutting, Michael A. Gaynes, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins +2 more | 1998-06-02 |
| 5747101 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Michael A. Gaynes, Robert M. Murcko, Viswanadham Puligandla, Judith Marie Roldan +1 more | 1998-05-05 |
| 5733466 | Electrolytic method of depositing gold connectors on a printed circuit board | Biebele Opubo Benebo, Edmund Glenn Benjamin, Robert D. Edwards, John J. Konrad, Timothy L. Wells | 1998-03-31 |