Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6281105 | Electrode modification using an unzippable polymer paste | John M. Cotte, Carlos J. Sambucetti, Ravi F. Saraf | 2001-08-28 |
| 6221503 | Electrode modification using an unzippable polymer paste | John M. Cotte, Carlos J. Sambucetti, Ravi F. Saraf | 2001-04-24 |
| 6197222 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Michael A. Gaynes, Richard B. Booth, Steven P. Ostrander, Emanuel I. Cooper +1 more | 2001-03-06 |
| 6174606 | Corrosion and dissolution protection of a conductive silver/polymer composite | Vlasta Brusic, Ravi F. Saraf | 2001-01-16 |
| 6127253 | Lead-free interconnection for electronic devices | Ravi F. Saraf | 2000-10-03 |
| 6099939 | Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology | Kashmiri L. Mittal, Carlos J. Sambucetti, Ravi F. Saraf | 2000-08-08 |
| 6015509 | Composition containing a polymer and conductive filler and use thereof | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 2000-01-18 |
| 6013713 | Electrode modification using an unzippable polymer paste | John M. Cotte, Carlos J. Sambucetti, Ravi F. Saraf | 2000-01-11 |
| 6005292 | Lead-free interconnection for electronic devices | Ravi F. Saraf | 1999-12-21 |
| 5997773 | Method for providing discharge protection or shielding | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1999-12-07 |
| 5985458 | Housing for electromagnetic interference shielding | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1999-11-16 |
| 5922466 | Composite comprising a metal substrate and a corrosion protecting layer | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1999-07-13 |
| 5916486 | Method for providing discharge protection or shielding | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1999-06-29 |
| 5897336 | Direct chip attach for low alpha emission interconnect system | Guy Paul Brouillette, David Danovitch, Michael Liehr, William T. Motsiff, Carlos J. Sambucetti +1 more | 1999-04-27 |
| 5866044 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Michael A. Gaynes, Richard B. Booth, Steven P. Ostrander, Emanuel I. Cooper +1 more | 1999-02-02 |
| 5854514 | Lead-free interconnection for electronic devices | Ravi F. Saraf | 1998-12-29 |
| 5834405 | Superconducting multilayer ceramic substrate | Byung-Tae Ahn, Robert B. Beyers, Emanuel I. Cooper, Edward A. Giess, Eugene J. O'Sullivan +1 more | 1998-11-10 |
| 5813870 | Selectively filled adhesives for semiconductor chip interconnection and encapsulation | Michael A. Gaynes, Jaynal A. Molla, Steven P. Ostrander, George J. Saxenmeyer, Jr., George F. Walker | 1998-09-29 |
| 5776587 | Electronic package comprising a substrate and a semiconductor device bonded thereto | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1998-07-07 |
| 5747101 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Michael A. Gaynes, Robert M. Murcko, Viswanadham Puligandla, Ravi F. Saraf +1 more | 1998-05-05 |
| 5700398 | Composition containing a polymer and conductive filler and use thereof | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Ravi F. Saraf +2 more | 1997-12-23 |
| 5545429 | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | Richard B. Booth, Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb +3 more | 1996-08-13 |
| 5543585 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Michael A. Gaynes, Robert M. Murco, Viswanadham Puligandla, Ravi F. Saraf +1 more | 1996-08-06 |
| 5310580 | Electroless metal adhesion to organic dielectric material with phase separated morphology | Eugene J. O'Sullivan, Terrence R. O'Toole, Lubomyr T. Romankiw, Carlos J. Sambucetti, Ravi F. Saraf | 1994-05-10 |
| 5225711 | Palladium enhanced soldering and bonding of semiconductor device contacts | Chin-An Chang, Nicholas G. Koopman, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh | 1993-07-06 |