| 9540863 |
Multi-pane glass unit having seal with adhesive and gas-restrictive coating layer |
Seth Miller, David H. Stark, William Francis, Edward Nashed Boulos, John Pernicka |
2017-01-10 |
| 8950162 |
Multi-pane glass unit having seal with adhesive and hermetic coating layer |
Seth Miller, David H. Stark, William Francis, Edward Nashed Boulos, John Pernicka |
2015-02-10 |
| 6236115 |
High density integrated circuit packaging with chip stacking and via interconnections |
Michael A. Gaynes, Alan J. Emerick, Charles G. Woychik, Jerzy M. Zalesinski |
2001-05-22 |
| 6187678 |
High density integrated circuit packaging with chip stacking and via interconnections |
Michael A. Gaynes, Alan J. Emerick, Charles G. Woychik, Jerzy M. Zalesinski |
2001-02-13 |
| 6002177 |
High density integrated circuit packaging with chip stacking and via interconnections |
Michael A. Gaynes, Alan J. Emerick, Charles G. Woychik, Jerzy M. Zalesinski |
1999-12-14 |
| 5747101 |
Direct chip attachment (DCA) with electrically conductive adhesives |
Richard B. Booth, Michael A. Gaynes, Robert M. Murcko, Judith Marie Roldan, Ravi F. Saraf +1 more |
1998-05-05 |
| 5543585 |
Direct chip attachment (DCA) with electrically conductive adhesives |
Richard B. Booth, Michael A. Gaynes, Robert M. Murco, Judith Marie Roldan, Ravi F. Saraf +1 more |
1996-08-06 |
| 4473602 |
Palladium activation of 2.5% silicon iron prior to electroless nickel plating |
Deepak Verma |
1984-09-25 |
| 4427448 |
Corrosion inhibiting compositions for metals |
Lenas J. Hedlund |
1984-01-24 |
