Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946055 | Method for recovering an organic solvent from a waste stream containing supercritical CO2 | Jerome J. Wagner | 2005-09-20 |
| 6931722 | Method of fabricating printed circuit board with mixed metallurgy pads | Edward Lee Arrington, Edmond O. Fey, Kevin Knadle, John J. Konrad, Joseph Alphonse Kotylo +5 more | 2005-08-23 |
| 6781064 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Bernd Karl Appelt, James W. Fuller, John M. Lauffer, Voya R. Markovich, William J. Rudik +1 more | 2004-08-24 |
| 6740819 | Printed wiring board | Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich, Thomas R. Miller | 2004-05-25 |
| 6699350 | Dielectric structure and method of formation | Stephen Joseph Fuerniss, Roy H. Magnuson, Voya R. Markovich | 2004-03-02 |
| 6664485 | Full additive process with filled plated through holes | Voya R. Markovich, Irving Memis, William E. Wilson | 2003-12-16 |
| 6608757 | Method for making a printed wiring board | Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich, Thomas R. Miller | 2003-08-19 |
| 6586683 | Printed circuit board with mixed metallurgy pads and method of fabrication | Edward Lee Arrington, Edmond O. Fey, Kevin Knadle, John J. Konrad, Joseph Alphonse Kotylo +5 more | 2003-07-01 |
| 6569604 | Blind via formation in a photoimageable dielectric material | Francis J. Downes, Jr., Robert Lee Lewis, JR., Voya R. Markovich | 2003-05-27 |
| 6495239 | Dielectric structure and method of formation | Stephen Joseph Fuerniss, Roy H. Magnuson, Voya R. Markovich | 2002-12-17 |
| 6453549 | Method of filling plated through holes | David E. Houser, John A. Welsh | 2002-09-24 |
| RE37840 | Method of preparing a printed circuit board | Roy H. Magnuson, Voya R. Markovich, Konstantinos I. Papathomas, Douglas O. Powell | 2002-09-17 |
| 6436803 | Manufacturing computer systems with fine line circuitized substrates | Roy H. Magnuson, Thomas R. Miller, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale | 2002-08-20 |
| 6423290 | Method for recovering an organic solvent from an acidic waste stream such as in integrated chip manufacturing | Jerome J. Wagner | 2002-07-23 |
| 6418616 | Full additive process with filled plated through holes | Voya R. Markovich, Irving Memis, William E. Wilson | 2002-07-16 |
| 6414509 | Method and apparatus for in-situ testing of integrated circuit chips | Leo Raymond Buda, Robert D. Edwards, Paul Joseph Hart, Anthony P. Ingraham, Voya R. Markovich +6 more | 2002-07-02 |
| 6386890 | Printed circuit board to module mounting and interconnecting structure and method | William L. Brodsky, Benson Chan | 2002-05-14 |
| 6268016 | Manufacturing computer systems with fine line circuitized substrates | Roy H. Magnuson, Thomas R. Miller, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale | 2001-07-31 |
| 6255208 | Selective wafer-level testing and burn-in | William E. Bernier, Claude L. Bertin, Michael A. Gaynes, Erik L. Hedberg, Nikhil M. Murdeshwar +5 more | 2001-07-03 |
| 6225028 | Method of making an enhanced organic chip carrier package | Thomas R. Miller, Allen F. Moring, James P. Walsh | 2001-05-01 |
| 6221694 | Method of making a circuitized substrate with an aperture | Michael J. Cummings, Thomas R. Miller, Kristen A. Stauffer, Michael Wozniak | 2001-04-24 |
| 6207354 | Method of making an organic chip carrier package | Thomas R. Miller, Allen F. Moring, James P. Walsh | 2001-03-27 |
| 6195883 | Full additive process with filled plated through holes | Voya R. Markovich, Irving Memis, William E. Wilson | 2001-03-06 |
| 6187965 | Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units | Jerome J. Wagner | 2001-02-13 |
| 6178093 | Information handling system with circuit assembly having holes filled with filler material | Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas, David J. Russell | 2001-01-23 |