| 6946055 |
Method for recovering an organic solvent from a waste stream containing supercritical CO2 |
Jerome J. Wagner |
2005-09-20 |
$5,282,000 |
| 6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads |
Edward Lee Arrington, Edmond O. Fey, Kevin Knadle, John J. Konrad, Joseph Alphonse Kotylo +5 more |
2005-08-23 |
$5,305,000 |
| 6781064 |
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same |
Bernd Karl Appelt, James W. Fuller, John M. Lauffer, Voya R. Markovich, William J. Rudik +1 more |
2004-08-24 |
$9,549,000 |
| 6740819 |
Printed wiring board |
Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich, Thomas R. Miller |
2004-05-25 |
$11,301,000 |
| 6699350 |
Dielectric structure and method of formation |
Stephen Joseph Fuerniss, Roy H. Magnuson, Voya R. Markovich |
2004-03-02 |
$12,738,000 |
| 6664485 |
Full additive process with filled plated through holes |
Voya R. Markovich, Irving Memis, William E. Wilson |
2003-12-16 |
$6,455,000 |
| 6608757 |
Method for making a printed wiring board |
Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich, Thomas R. Miller |
2003-08-19 |
$23,908,000 |
| 6586683 |
Printed circuit board with mixed metallurgy pads and method of fabrication |
Edward Lee Arrington, Edmond O. Fey, Kevin Knadle, John J. Konrad, Joseph Alphonse Kotylo +5 more |
2003-07-01 |
$13,647,000 |
| 6569604 |
Blind via formation in a photoimageable dielectric material |
Francis J. Downes, Jr., Robert Lee Lewis, JR., Voya R. Markovich |
2003-05-27 |
$11,691,000 |
| 6495239 |
Dielectric structure and method of formation |
Stephen Joseph Fuerniss, Roy H. Magnuson, Voya R. Markovich |
2002-12-17 |
$17,155,000 |
| 6453549 |
Method of filling plated through holes |
David E. Houser, John A. Welsh |
2002-09-24 |
$8,983,000 |
| RE37840 |
Method of preparing a printed circuit board |
Roy H. Magnuson, Voya R. Markovich, Konstantinos I. Papathomas, Douglas O. Powell |
2002-09-17 |
|
| 6436803 |
Manufacturing computer systems with fine line circuitized substrates |
Roy H. Magnuson, Thomas R. Miller, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale |
2002-08-20 |
$9,830,000 |
| 6423290 |
Method for recovering an organic solvent from an acidic waste stream such as in integrated chip manufacturing |
Jerome J. Wagner |
2002-07-23 |
$13,664,000 |
| 6418616 |
Full additive process with filled plated through holes |
Voya R. Markovich, Irving Memis, William E. Wilson |
2002-07-16 |
$9,944,000 |
| 6414509 |
Method and apparatus for in-situ testing of integrated circuit chips |
Leo Raymond Buda, Robert D. Edwards, Paul Joseph Hart, Anthony P. Ingraham, Voya R. Markovich +6 more |
2002-07-02 |
$11,850,000 |
| 6386890 |
Printed circuit board to module mounting and interconnecting structure and method |
William L. Brodsky, Benson Chan |
2002-05-14 |
$14,429,000 |
| 6268016 |
Manufacturing computer systems with fine line circuitized substrates |
Roy H. Magnuson, Thomas R. Miller, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale |
2001-07-31 |
$29,242,000 |
| 6255208 |
Selective wafer-level testing and burn-in |
William E. Bernier, Claude L. Bertin, Michael A. Gaynes, Erik L. Hedberg, Nikhil M. Murdeshwar +5 more |
2001-07-03 |
$26,086,000 |
| 6225028 |
Method of making an enhanced organic chip carrier package |
Thomas R. Miller, Allen F. Moring, James P. Walsh |
2001-05-01 |
$28,625,000 |
| 6221694 |
Method of making a circuitized substrate with an aperture |
Michael J. Cummings, Thomas R. Miller, Kristen A. Stauffer, Michael Wozniak |
2001-04-24 |
$20,927,000 |
| 6207354 |
Method of making an organic chip carrier package |
Thomas R. Miller, Allen F. Moring, James P. Walsh |
2001-03-27 |
$29,796,000 |
| 6195883 |
Full additive process with filled plated through holes |
Voya R. Markovich, Irving Memis, William E. Wilson |
2001-03-06 |
$28,649,000 |
| 6187965 |
Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units |
Jerome J. Wagner |
2001-02-13 |
$30,258,000 |
| 6178093 |
Information handling system with circuit assembly having holes filled with filler material |
Donald Herman Glatzel, Allen F. Moring, Voya R. Markovich, Kostas Papathomas, David J. Russell |
2001-01-23 |
$22,404,000 |
