| 9351408 |
Coreless layer buildup structure with LGA and joining layer |
Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, Rabindra N. Das |
2016-05-24 |
|
| 8541687 |
Coreless layer buildup structure |
Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, Rabindra N. Das |
2013-09-24 |
|
| 8536459 |
Coreless layer buildup structure with LGA |
Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, Rabindra N. Das |
2013-09-17 |
|
| 8405229 |
Electronic package including high density interposer and circuitized substrate assembly utilizing same |
Timothy Antesberger, Frank D. Egitto, Voya R. Markovich |
2013-03-26 |
|
| 8245392 |
Method of making high density interposer and electronic package utilizing same |
Timothy Antesberger, Frank D. Egitto, Voya R. Markovich |
2012-08-21 |
|
| 8240031 |
Method of joining a semiconductor device/chip to a printed wiring board |
Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das +1 more |
2012-08-14 |
|
| 7381587 |
Method of making circuitized substrate |
Robert M. Japp, John M. Lauffer, Voya R. Markovich |
2008-06-03 |
|
| 7353590 |
Method of forming printed circuit card |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2008-04-08 |
$6,866,000 |
| 7328502 |
Apparatus for making circuitized substrates in a continuous manner |
John M. Lauffer, Voya R. Markovich, James W. Orband |
2008-02-12 |
|
| 7293355 |
Apparatus and method for making circuitized substrates in a continuous manner |
John M. Lauffer, Voya R. Markovich, James W. Orband |
2007-11-13 |
|
| 6986198 |
Method of forming printed circuit card |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2006-01-17 |
$9,394,000 |
| 6852152 |
Colloidal seed formulation for printed circuit board metallization |
Raymond T. Galasco, Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller, Anita Sargent |
2005-02-08 |
$9,552,000 |
| 6830875 |
Forming a through hole in a photoimageable dielectric structure |
Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more |
2004-12-14 |
$7,399,000 |
| 6781064 |
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same |
Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich +1 more |
2004-08-24 |
$9,549,000 |
| 6750405 |
Two signal one power plane circuit board |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2004-06-15 |
$11,083,000 |
| 6739048 |
Process of fabricating a circuitized structure |
Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, William J. Rudik, James Warren Wilson |
2004-05-25 |
$11,301,000 |
| 6664485 |
Full additive process with filled plated through holes |
Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis |
2003-12-16 |
$6,455,000 |
| 6547974 |
Method of producing fine-line circuit boards using chemical polishing |
Stanley M. Albrechta, Christina M. Boyko, Kathleen L. Covert, Natalie B. Feilchenfeld, Voya R. Markovich +1 more |
2003-04-15 |
$16,310,000 |
| 6521844 |
Through hole in a photoimageable dielectric structure with wired and uncured dielectric |
Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more |
2003-02-18 |
$14,090,000 |
| 6479093 |
Composite laminate circuit structure and methods of interconnecting the same |
John M. Lauffer, Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas |
2002-11-12 |
$19,603,000 |
| 6451509 |
Composite laminate circuit structure and method of forming the same |
Ross W. Keesler, Voya R. Markovich, Jim P. Paoletti, Marybeth Perrino |
2002-09-17 |
$8,846,000 |
| 6418616 |
Full additive process with filled plated through holes |
Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis |
2002-07-16 |
$9,944,000 |
| 6388204 |
Composite laminate circuit structure and methods of interconnecting the same |
John M. Lauffer, Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas |
2002-05-14 |
$14,429,000 |
| 6265075 |
Circuitized semiconductor structure and method for producing such |
David Anton Klueppel, Voya R. Markovich, Thomas R. Miller, Timothy L. Wells |
2001-07-24 |
$31,737,000 |
| 6264851 |
Selective seed and plate using permanent resist |
Voya R. Markovich, Michael Wozniak |
2001-07-24 |
$31,737,000 |
