Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9351408 | Coreless layer buildup structure with LGA and joining layer | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, Rabindra N. Das | 2016-05-24 |
| 8541687 | Coreless layer buildup structure | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, Rabindra N. Das | 2013-09-24 |
| 8536459 | Coreless layer buildup structure with LGA | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, Rabindra N. Das | 2013-09-17 |
| 8405229 | Electronic package including high density interposer and circuitized substrate assembly utilizing same | Timothy Antesberger, Frank D. Egitto, Voya R. Markovich | 2013-03-26 |
| 8245392 | Method of making high density interposer and electronic package utilizing same | Timothy Antesberger, Frank D. Egitto, Voya R. Markovich | 2012-08-21 |
| 8240031 | Method of joining a semiconductor device/chip to a printed wiring board | Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das +1 more | 2012-08-14 |
| 7381587 | Method of making circuitized substrate | Robert M. Japp, John M. Lauffer, Voya R. Markovich | 2008-06-03 |
| 7353590 | Method of forming printed circuit card | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more | 2008-04-08 |
| 7328502 | Apparatus for making circuitized substrates in a continuous manner | John M. Lauffer, Voya R. Markovich, James W. Orband | 2008-02-12 |
| 7293355 | Apparatus and method for making circuitized substrates in a continuous manner | John M. Lauffer, Voya R. Markovich, James W. Orband | 2007-11-13 |
| 6986198 | Method of forming printed circuit card | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more | 2006-01-17 |
| 6852152 | Colloidal seed formulation for printed circuit board metallization | Raymond T. Galasco, Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller, Anita Sargent | 2005-02-08 |
| 6830875 | Forming a through hole in a photoimageable dielectric structure | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more | 2004-12-14 |
| 6781064 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich +1 more | 2004-08-24 |
| 6750405 | Two signal one power plane circuit board | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more | 2004-06-15 |
| 6739048 | Process of fabricating a circuitized structure | Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, William J. Rudik, James Warren Wilson | 2004-05-25 |
| 6664485 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis | 2003-12-16 |
| 6547974 | Method of producing fine-line circuit boards using chemical polishing | Stanley M. Albrechta, Christina M. Boyko, Kathleen L. Covert, Natalie B. Feilchenfeld, Voya R. Markovich +1 more | 2003-04-15 |
| 6521844 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more | 2003-02-18 |
| 6479093 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas | 2002-11-12 |
| 6451509 | Composite laminate circuit structure and method of forming the same | Ross W. Keesler, Voya R. Markovich, Jim P. Paoletti, Marybeth Perrino | 2002-09-17 |
| 6418616 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis | 2002-07-16 |
| 6388204 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas | 2002-05-14 |
| 6265075 | Circuitized semiconductor structure and method for producing such | David Anton Klueppel, Voya R. Markovich, Thomas R. Miller, Timothy L. Wells | 2001-07-24 |
| 6264851 | Selective seed and plate using permanent resist | Voya R. Markovich, Michael Wozniak | 2001-07-24 |