Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through hole in a photoimageable dielectric structure with wired and uncured dielectric

Through hole in a photoimageable dielectric structure with wired and uncured dielectric

US Patent 6521844 · Granted Feb 18, 2003

Estimated economic value: $14,090,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dynamically deployable adaptive mud flaps2025
Electric vehicle driving aid method and system2025
BEV powertrain/steering controls for enhanced stability on inclined surfaces2025
Glass cloth including attached fibers2020
Reduced-warpage laminate structure2020
Coating for limiting substrate damage due to discrete failure2019
Coating for limiting substrate damage due to discrete failure2019
Interface for limiting substrate damage due to discrete failure2019
Reduction of solder interconnect stress2019
Method of fabricating contacts of an electronic package structure to reduce sold2019
Interface for limiting substrate damage due to discrete failure2019
Electroactive materials2019