| 7977034 |
Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner |
John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr. |
2011-07-12 |
| 7827682 |
Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner |
John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr. |
2010-11-09 |
| 6830627 |
Copper cleaning compositions, processes and products derived therefrom |
Kathleen L. Covert, John M. Lauffer |
2004-12-14 |
| 6830875 |
Forming a through hole in a photoimageable dielectric structure |
Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more |
2004-12-14 |
| 6521328 |
Copper etching compositions and products derived therefrom |
John M. Lauffer, Kathleen L. Covert |
2003-02-18 |
| 6521844 |
Through hole in a photoimageable dielectric structure with wired and uncured dielectric |
Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich +2 more |
2003-02-18 |
| 6291776 |
Thermal deformation management for chip carriers |
Voya R. Markovich, Seungbae Park, Sanjeev Sathe |
2001-09-18 |
| 6156221 |
Copper etching compositions, processes and products derived therefrom |
John M. Lauffer, Kathleen L. Covert |
2000-12-05 |
| 4786528 |
Process for treating reinforced polymer composite |
William J. Amelio, Voya R. Markovich, William J. McCarthy, Allen F. Moring, Douglas H. Strope |
1988-11-22 |
