| 6908684 |
Promoting adhesion between a polymer and a metallic substrate |
Joseph Alphonse Kotylo, Luis J. Matienzo, Norman L. Shaver, Anastasios Angelopoulos |
2005-06-21 |
| 6830875 |
Forming a through hole in a photoimageable dielectric structure |
Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich, Peter A. Moschak +2 more |
2004-12-14 |
| 6790473 |
Lead protective coating composition, process and structure thereof |
Konstantinos I. Papathomas, Deborah L. Dittrich, David W. Wang |
2004-09-14 |
| 6730409 |
Promoting adhesion between a polymer and a metallic substrate |
Anastasios Angelopoulos, Joseph Alphonse Kotylo, Luis J. Matienzo, Norman L. Shaver |
2004-05-04 |
| 6699350 |
Dielectric structure and method of formation |
Anilkumar C. Bhatt, Roy H. Magnuson, Voya R. Markovich |
2004-03-02 |
| 6521844 |
Through hole in a photoimageable dielectric structure with wired and uncured dielectric |
Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich, Peter A. Moschak +2 more |
2003-02-18 |
| 6495239 |
Dielectric structure and method of formation |
Anilkumar C. Bhatt, Roy H. Magnuson, Voya R. Markovich |
2002-12-17 |
| 6485892 |
Method for masking a hole in a substrate during plating |
Lawrence Robert Blumberg, Norman A. Card, Richard A. Day, John J. Konrad, Jeffrey McKeveny +1 more |
2002-11-26 |
| 6156484 |
Gray scale etching for thin flexible interposer |
Ernest Bassous, Gobinda Das, Frank D. Egitto, Natalie B. Feilchenfeld, Elizabeth Foster +4 more |
2000-12-05 |
| 6150255 |
Method of planarizing a curved substrate and resulting structure |
Francis J. Downes, Jr., Gary R. Hill, Anthony P. Ingraham, Voya R. Markovich, Jaynal A. Molla |
2000-11-21 |
| 6150726 |
Component carrier with raised bonding sites |
Natalie B. Feilchenfeld, Michael A. Gaynes, Mark V. Pierson, Pat Hoontrakul |
2000-11-21 |
| 6129955 |
Encapsulating a solder joint with a photo cured epoxy resin or cyanate |
Konstantinos I. Papathomas, Deborah L. Dittrich, David W. Wang |
2000-10-10 |
| 6015520 |
Method for filling holes in printed wiring boards |
Bernd Karl Appelt, Christina M. Boyko, Donald S. Farquhar, Michael Joseph Klodowski |
2000-01-18 |
| 5940729 |
Method of planarizing a curved substrate and resulting structure |
Francis J. Downes, Jr., Gary R. Hill, Anthony P. Ingraham, Voya R. Markovich, Jaynal A. Molla |
1999-08-17 |
| 5919596 |
Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making |
Jeffrey Hedrick, Konstantinos I. Papathomas, Stephen L. Tisdale, Alfred Viehbeck, Jeffrey D. Gelorme +2 more |
1999-07-06 |
| 5872337 |
Chip carrier and cable assembly reinforced at edges |
Donald S. Farquhar, Charles R. Davis, David L. Questad, Darbha Suryanarayana, Jeffrey Zimmerman |
1999-02-16 |
| 5759737 |
Method of making a component carrier |
Natalie B. Feilchenfeld, Michael A. Gaynes, Mark V. Pierson, Pat Hoontrakul |
1998-06-02 |
| 4883744 |
Forming a polymide pattern on a substrate |
Natalie B. Feilchenfeld, John J. Glenning, Walter P. Pawlowski, Giana M. Phelan, Paul George Rickerl |
1989-11-28 |
| 4517281 |
Development process for aqueous developable photopolymerizable elements |
Gary C. Briney |
1985-05-14 |
| 4497889 |
Release compound in negative acting photopolymerizable element |
— |
1985-02-05 |
| 4485167 |
Aqueous developable photopolymerizable elements |
Gary C. Briney |
1984-11-27 |
