Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8293141 | Electronic device comprising electrically stable copper filled electrically conductive adhesive | Michael A. Gaynes, Jeffrey D. Gelorme, Rebecca Suzanne Northey, Michael B. Vincent | 2012-10-23 |
| 7823274 | Method of making multilayered circuitized substrate assembly | Frank D. Egitto, Voya R. Markovich | 2010-11-02 |
| 7763188 | Electrically stable copper filled electrically conductive adhesive | Michael A. Gaynes, Jeffrey D. Gelorme, Rebecca Suzanne Northey, Michael B. Vincent | 2010-07-27 |
| 7342183 | Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same | Frank D. Egitto, Voya R. Markovich | 2008-03-11 |
| 7334323 | Method of making mutilayered circuitized substrate assembly having sintered paste connections | Frank D. Egitto, Voya R. Markovich | 2008-02-26 |
| 7309529 | Structure and method for improved adhesion between two polymer films | Frank D. Egitto | 2007-12-18 |
| 7307022 | Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof | Frank D. Egitto, Stephen Krasniak, John M. Lauffer, Voya R. Markovich | 2007-12-11 |
| 7067193 | Structure and method for improved adhesion between two polymer films | Frank D. Egitto | 2006-06-27 |
| 6908684 | Promoting adhesion between a polymer and a metallic substrate | Stephen Joseph Fuerniss, Joseph Alphonse Kotylo, Norman L. Shaver, Anastasios Angelopoulos | 2005-06-21 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson | 2004-08-03 |
| 6759597 | Wire bonding to dual metal covered pad surfaces | Lawrence R. Cutting, John G. Gaudiello, Nikhil M. Murdeshwar | 2004-07-06 |
| 6730409 | Promoting adhesion between a polymer and a metallic substrate | Anastasios Angelopoulos, Stephen Joseph Fuerniss, Joseph Alphonse Kotylo, Norman L. Shaver | 2004-05-04 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson | 2004-04-13 |
| 6713858 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Son K. Tran | 2004-03-30 |
| 6693031 | Formation of a metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Ronald A. Kaschak, John S. Kresge, Daniel C. Van Hart | 2004-02-17 |
| 6656313 | Structure and method for improved adhesion between two polymer films | Frank D. Egitto | 2003-12-02 |
| 6613184 | Stable interfaces between electrically conductive adhesives and metals | Frank D. Egitto, Paul Logan | 2003-09-02 |
| 6607613 | Solder ball with chemically and mechanically enhanced surface properties | Frank D. Egitto, Edmond O. Fey, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2003-08-19 |
| 6596559 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Son K. Tran | 2003-07-22 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson | 2003-06-10 |
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-06-10 |
| 6519845 | Wire bonding to dual metal covered pad surfaces | Lawrence R. Cutting, John G. Gaudiello, Nikhil M. Murdeshwar | 2003-02-18 |
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-02-18 |
| 6447914 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure | Anastasios Angelopoulos, Gerald W. Jones, Thomas R. Miller, William D. Taylor | 2002-09-10 |
| 6420253 | Method for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gary Johansson, Gerald W. Jones, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2002-07-16 |