Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835441 | Bonding together surfaces | Michael A. Gaynes | 2004-12-28 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2004-08-03 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2004-04-13 |
| 6713858 | Flip-chip package with optimized encapsulant adhesion and method | Luis J. Matienzo, Son K. Tran | 2004-03-30 |
| 6639638 | LCD cover optical structure and method | Mark V. Pierson, William J. Rudik, David B. Stone | 2003-10-28 |
| 6596559 | Flip-chip package with optimized encapsulant adhesion and method | Luis J. Matienzo, Son K. Tran | 2003-07-22 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2003-06-10 |
| 6517662 | Process for making semiconductor chip assembly | Thomas M. Culnane, Michael A. Gaynes, Mark V. Pierson, Charles G. Woychik | 2003-02-11 |
| 6487461 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Mark V. Pierson, Edward J. Tasillo | 2002-11-26 |
| 6458005 | Selectively compliant chuck for LCD assembly | Richard Lee Baker, Ronald J. Becker, Allan O. Johnson | 2002-10-01 |
| 6447885 | Bonding together surfaces | Michael A. Gaynes | 2002-09-10 |
| 6444407 | Plate for liquid crystal display, method and polymeric compositions | Richard A. Day, Konstantinos I. Papathomas | 2002-09-03 |
| 6344099 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Mark V. Pierson, Edward J. Tasillo | 2002-02-05 |
| 6248614 | Flip-chip package with optimized encapsulant adhesion and method | Luis J. Matienzo, Son K. Tran | 2001-06-19 |
| 6206997 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2001-03-27 |
| 6193576 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Mark V. Pierson, Edward J. Tasillo | 2001-02-27 |
| 6174406 | Bonding together surfaces | Michael A. Gaynes | 2001-01-16 |
| 6129804 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Mark V. Pierson, Edward J. Tasillo | 2000-10-10 |
| 5973389 | Semiconductor chip carrier assembly | Thomas M. Culnane, Michael A. Gaynes, Mark V. Pierson, Charles G. Woychik | 1999-10-26 |
| 5889321 | Stiffeners with improved adhesion to flexible substrates | Thomas M. Culnane, Michael A. Gaynes, Mark V. Pierson | 1999-03-30 |