Issued Patents All Time
Showing 25 most recent of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11083316 | Recyclable and dispensable cutlery utensil | Anthony D'Amelia | 2021-08-10 |
| 10820722 | No touch utensil dispenser | Anthony D'Amelia | 2020-11-03 |
| 9211558 | Toothpaste dispenser | Mark H. Levy | 2015-12-15 |
| 8272533 | No touch utensil dispenser | Anthony D'Amelia | 2012-09-25 |
| 8089133 | Optical assemblies for transmitting and manipulating optical beams | Dinesh Gupta, Brenda Peterson, Eugen Schenfeld, Subhash L. Shinde | 2012-01-03 |
| 7718902 | Z interconnect structure and method | Lisa J. Jimarez | 2010-05-18 |
| 7335325 | Formable structure between two objects | — | 2008-02-26 |
| 6980392 | System and method for capturing contaminants within a disk drive | — | 2005-12-27 |
| 6955982 | Flip chip C4 extension structure and process | Miguel A. Jimarez, Cynthia S. Milkovich | 2005-10-18 |
| 6946329 | Methods of making and using a floating interposer | Jennifer Sweterlitsch, Charles G. Woychik, Thurston Bryce Youngs, Jr. | 2005-09-20 |
| 6922294 | Optical communication assembly | Eugen Schenfeld | 2005-07-26 |
| 6917728 | Fiber optic attachment method, structure, and system | Michael Lemmon | 2005-07-12 |
| 6836015 | Optical assemblies for transmitting and manipulating optical beams | Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven P. Ostrander, Brenda Peterson +2 more | 2004-12-28 |
| 6805280 | Z interconnect structure and method | Lisa J. Jimarez | 2004-10-19 |
| 6774472 | Panel structure with plurality of chip compartments for providing high volume of chip modules | — | 2004-08-10 |
| 6774315 | Floating interposer | Jennifer Sweterlitsch, Charles G. Woychik, Thurston Bryce Youngs, Jr. | 2004-08-10 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2004-08-03 |
| 6759738 | Systems interconnected by bumps of joining material | Kenneth Michael Fallon, Christian Robert Le Coz | 2004-07-06 |
| 6756680 | Flip chip C4 extension structure and process | Miguel A. Jimarez, Cynthia S. Milkovich | 2004-06-29 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2004-04-13 |
| 6708871 | Method for forming solder connections on a circuitized substrate | — | 2004-03-23 |
| 6699736 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, William J. Rudik, David L. Thomas | 2004-03-02 |
| 6674647 | Low or no-force bump flattening structure and method | Ajit K. Trivedi | 2004-01-06 |
| 6664637 | Flip chip C4 extension structure and process | Miguel A. Jimarez, Cynthia S. Milkovich | 2003-12-16 |
| 6661661 | Common heatsink for multiple chips and modules | Michael A. Gaynes, Howard Victor Mahaney, Jr. | 2003-12-09 |