| 11083316 |
Recyclable and dispensable cutlery utensil |
Anthony D'Amelia |
2021-08-10 |
|
| 10820722 |
No touch utensil dispenser |
Anthony D'Amelia |
2020-11-03 |
|
| 9211558 |
Toothpaste dispenser |
Mark H. Levy |
2015-12-15 |
|
| 8272533 |
No touch utensil dispenser |
Anthony D'Amelia |
2012-09-25 |
|
| 8089133 |
Optical assemblies for transmitting and manipulating optical beams |
Dinesh Gupta, Brenda Peterson, Eugen Schenfeld, Subhash L. Shinde |
2012-01-03 |
$8,800,000 |
| 7718902 |
Z interconnect structure and method |
Lisa J. Jimarez |
2010-05-18 |
$4,666,000 |
| 7335325 |
Formable structure between two objects |
— |
2008-02-26 |
|
| 6980392 |
System and method for capturing contaminants within a disk drive |
— |
2005-12-27 |
$5,960,000 |
| 6955982 |
Flip chip C4 extension structure and process |
Miguel A. Jimarez, Cynthia S. Milkovich |
2005-10-18 |
$9,308,000 |
| 6946329 |
Methods of making and using a floating interposer |
Jennifer Sweterlitsch, Charles G. Woychik, Thurston Bryce Youngs, Jr. |
2005-09-20 |
$5,282,000 |
| 6922294 |
Optical communication assembly |
Eugen Schenfeld |
2005-07-26 |
$7,521,000 |
| 6917728 |
Fiber optic attachment method, structure, and system |
Michael Lemmon |
2005-07-12 |
$9,006,000 |
| 6836015 |
Optical assemblies for transmitting and manipulating optical beams |
Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven P. Ostrander, Brenda Peterson +2 more |
2004-12-28 |
$11,084,000 |
| 6805280 |
Z interconnect structure and method |
Lisa J. Jimarez |
2004-10-19 |
$7,667,000 |
| 6774472 |
Panel structure with plurality of chip compartments for providing high volume of chip modules |
— |
2004-08-10 |
$6,982,000 |
| 6774315 |
Floating interposer |
Jennifer Sweterlitsch, Charles G. Woychik, Thurston Bryce Youngs, Jr. |
2004-08-10 |
$6,982,000 |
| 6770968 |
Method for bonding heat sinks to overmolds and device formed thereby |
Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo |
2004-08-03 |
$6,296,000 |
| 6759738 |
Systems interconnected by bumps of joining material |
Kenneth Michael Fallon, Christian Robert Le Coz |
2004-07-06 |
$6,814,000 |
| 6756680 |
Flip chip C4 extension structure and process |
Miguel A. Jimarez, Cynthia S. Milkovich |
2004-06-29 |
$8,425,000 |
| 6719871 |
Method for bonding heat sinks to overmolds and device formed thereby |
Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo |
2004-04-13 |
$7,725,000 |
| 6708871 |
Method for forming solder connections on a circuitized substrate |
— |
2004-03-23 |
$10,149,000 |
| 6699736 |
Electrical coupling of a stiffener to a chip carrier |
Terry J. Dornbos, Raymond Phillips, William J. Rudik, David L. Thomas |
2004-03-02 |
$12,738,000 |
| 6674647 |
Low or no-force bump flattening structure and method |
Ajit K. Trivedi |
2004-01-06 |
$7,683,000 |
| 6664637 |
Flip chip C4 extension structure and process |
Miguel A. Jimarez, Cynthia S. Milkovich |
2003-12-16 |
$6,455,000 |
| 6661661 |
Common heatsink for multiple chips and modules |
Michael A. Gaynes, Howard Victor Mahaney, Jr. |
2003-12-09 |
$6,520,000 |
