Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6193576 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Ramesh R. Kodnani, Edward J. Tasillo | 2001-02-27 |
| 6187610 | Flexible thin film ball grid array containing solder mask | Gregg J. Armezzani, Robert Nicholas Ives, Terry Alan Tull | 2001-02-13 |
| 6179196 | Apparatus for manufacturing circuit boards | Craig G. Heim, Russell H. Lewis, Karl J. Puttlitz | 2001-01-30 |
| 6177729 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more | 2001-01-23 |
| 6173887 | Method of making electrically conductive contacts on substrates | Donald I. Mead | 2001-01-16 |
| 6165885 | Method of making components with solder balls | Michael A. Gaynes | 2000-12-26 |
| 6156165 | Method of forming a metallization feature on an edge of an IC chip | Thurston Bryce Youngs, Jr. | 2000-12-05 |
| 6150726 | Component carrier with raised bonding sites | Natalie B. Feilchenfeld, Stephen Joseph Fuerniss, Michael A. Gaynes, Pat Hoontrakul | 2000-11-21 |
| 6142361 | Chip C4 assembly improvement using magnetic force and adhesive | Francis J. Downes, Jr., Robert M. Japp | 2000-11-07 |
| 6129804 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Ramesh R. Kodnani, Edward J. Tasillo | 2000-10-10 |
| 6115912 | Apparatus and method for printed circuit board repair | Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Amit K. Sarkhel, Ajit K. Trivedi | 2000-09-12 |
| 6100114 | Encapsulation of solder bumps and solder connections | Cynthia S. Milkovich, Son K. Tran | 2000-08-08 |
| 6068175 | System for replacing a first area array component connected to an interconnect board | Craig G. Heim, Russell H. Lewis, Karl J. Puttlitz | 2000-05-30 |
| 6059939 | Method for high density edge mounting of chips | Thurston Bryce Youngs, Jr. | 2000-05-09 |
| 6027006 | Method and apparatus for applying solder and forming solder balls on a substrate | — | 2000-02-22 |
| 6018866 | Apparatus and method for printed circuit board repair | Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Amit K. Sarkhel, Ajit K. Trivedi | 2000-02-01 |
| 5973389 | Semiconductor chip carrier assembly | Thomas M. Culnane, Michael A. Gaynes, Ramesh R. Kodnani, Charles G. Woychik | 1999-10-26 |
| 5969945 | Electronic package assembly | Lawrence R. Cutting, Michael A. Gaynes, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins +2 more | 1999-10-19 |
| 5938106 | Method and apparatus for applying solder and forming solder balls on a substrate | — | 1999-08-17 |
| 5903437 | High density edge mounting of chips | Thurston Bryce Youngs, Jr. | 1999-05-11 |
| 5889321 | Stiffeners with improved adhesion to flexible substrates | Thomas M. Culnane, Michael A. Gaynes, Ramesh R. Kodnani | 1999-03-30 |
| 5889654 | Advanced chip packaging structure for memory card applications | Kenneth L. Spink, Jr., Thurston Bryce Youngs, Jr. | 1999-03-30 |
| 5875010 | Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices | Jeffrey C. Baechtle, Michael A. Gaynes, Anne Marie Quinn, David B. Stone | 1999-02-23 |
| 5875011 | Liquid crystal display tile interconnected to a tile carrier and method | Michael A. Gaynes, David B. Stone, Thurston Bryce Youngs, Jr. | 1999-02-23 |
| 5872051 | Process for transferring material to semiconductor chip conductive pads using a transfer substrate | Kenneth Michael Fallon, Christian Robert Le Coz | 1999-02-16 |