Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653575 | Electronic package with stacked connections and method for making same | Matthew Heller | 2003-11-25 |
| 6617528 | Electronic package with stacked connections and method for making same | Matthew Heller | 2003-09-09 |
| 6574113 | Electronic package with stacked connections and method for making same | Matthew Heller | 2003-06-03 |
| 6452116 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Kishor Desai, Jeffrey S. Perkins, John J. Pessarchick | 2002-09-17 |
| 6281437 | Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connection | Steven Anderson, Daniel P. Labzentis | 2001-08-28 |
| 6272742 | Method of electrically connecting substrates using solder balls | Kishor Desai, Jeffery S. Perkins, John J. Pessarchick | 2001-08-14 |
| 6198634 | Electronic package with stacked connections | Matthew Heller | 2001-03-06 |
| 6187610 | Flexible thin film ball grid array containing solder mask | Robert Nicholas Ives, Mark V. Pierson, Terry Alan Tull | 2001-02-13 |
| 6023029 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Kishor Desai, Jeffery S. Perkins, John J. Pessarchick | 2000-02-08 |
| 5884397 | Method for fabricating chip carriers and printed circuit boards | Kishor Desai, Jeffrey S. Perkins, John J. Pessarchick | 1999-03-23 |
| 5818697 | Flexible thin film ball grid array containing solder mask | Robert Nicholas Ives, Mark V. Pierson, Terry Alan Tull | 1998-10-06 |