DL

Daniel P. Labzentis

IBM: 3 patents #26,272 of 70,183Top 40%
Overall (All Time): #1,041,103 of 4,157,543Top 30%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6515233 Method of producing flex circuit with selectively plated gold Francesco Marconi, Allan R. Knoll, David J. Bajkowski 2003-02-04
6383401 Method of producing flex circuit with selectively plated gold Francesco Marconi, Allan R. Knoll, David J. Bajkowski 2002-05-07
6281437 Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connection Steven Anderson, Gregg J. Armezzani 2001-08-28
5766499 Method of making a circuitized substrate Kim J. Blackwell, Jonathan D. Reid 1998-06-16
5731547 Circuitized substrate with material containment means and method of making same Mark Daniel Derwin, Jonathan D. Reid, Timothy Lee Sharp 1998-03-24