Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5827386 | Method for forming a multi-layered circuitized substrate member | Ashwinkumar C. Bhatt, Kenneth J. Lubert | 1998-10-27 | $24,831,000 |
| 5731547 | Circuitized substrate with material containment means and method of making same | Daniel P. Labzentis, Jonathan D. Reid, Timothy Lee Sharp | 1998-03-24 | $15,296,000 |