AK

Allan R. Knoll

IBM: 9 patents #11,918 of 70,183Top 20%
SU Superpower: 4 patents #7 of 35Top 20%
📍 Endicott, NY: #56 of 620 inventorsTop 10%
🗺 New York: #9,734 of 115,490 inventorsTop 9%
Overall (All Time): #325,928 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
7702373 Superconducting articles, and methods for forming and using same Kenneth Lenseth 2010-04-20
7365271 Superconducting articles, and methods for forming and using same Venkat Selvamanickam, Chandra Reis 2008-04-29
7162286 Superconducting articles, and methods for forming and using same Kenneth Lenseth 2007-01-09
7071148 Joined superconductive articles Venkat Selvamanickam, Yi-Yuan Xie 2006-07-04
6515233 Method of producing flex circuit with selectively plated gold Daniel P. Labzentis, Francesco Marconi, David J. Bajkowski 2003-02-04
6383401 Method of producing flex circuit with selectively plated gold Daniel P. Labzentis, Francesco Marconi, David J. Bajkowski 2002-05-07
6337004 High adhesion performance roll sputtered strike layer Kim J. Blackwell, Pei C. Chen, Frank D. Egitto, George J. Matarese, Luis J. Matienzo 2002-01-08
6284329 Method of forming adherent metal components on a polyimide substrate Luis J. Matienzo, Kim J. Blackwell, Frank D. Egitto 2001-09-04
6235411 Process for coating a substrate with metallic layer Kim J. Blackwell, Pei C. Chen, Luis J. Matienzo, Richard D. Weale 2001-05-22
6194076 Method of forming adherent metal components on a polyimide substrate Luis J. Matienzo, Kim J. Blackwell, Frank D. Egitto 2001-02-27
5525369 Method for metallizing through holes in thin film substrates, and resulting devices Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, George J. Matarese, Richard D. Weale 1996-06-11
5461203 Electronic package including lower water content polyimide film Kim J. Blackwell, Pei C. Chen, Frank D. Egitto, George J. Matarese, Luis J. Matienzo 1995-10-24
5372848 Process for creating organic polymeric substrate with copper Kim J. Blackwell, Luis J. Matienzo 1994-12-13
5288541 Method for metallizing through holes in thin film substrates, and resulting devices Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, George J. Matarese, Richard D. Weale 1994-02-22
5053104 Method of plasma etching a substrate with a gaseous organohalide compound Suryadevara V. Babu, Joseph G. Hoffarth, Walter E. Mlynko, John F. Rembetski, Kenneth D. Mack 1991-10-01