| 7846305 |
Method and apparatus for increasing uniformity in ion mill process |
Omar Eduardo Montero Camacho, Laurence S. Samuelson, Yongjian Sun |
2010-12-07 |
$74,000 |
| 7560225 |
Method of forming uniform features using photoresist |
Omar Eduardo Montero Camacho, Cherngye Hwang, Diana Perez, Eric Sun |
2009-07-14 |
$104,000 |
| 7481312 |
Direct cooling pallet assembly for temperature stability for deep ion mill etch process |
Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun |
2009-01-27 |
$115,000 |
| 7296420 |
Direct cooling pallet tray for temperature stability for deep ion mill etch process |
Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun |
2007-11-20 |
$247,000 |
| 6532134 |
Silicon coating on air bearing surface for magnetic thin film heads |
Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons |
2003-03-11 |
$18,284,000 |
| 6337004 |
High adhesion performance roll sputtered strike layer |
Kim J. Blackwell, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo |
2002-01-08 |
$17,918,000 |
| 6235411 |
Process for coating a substrate with metallic layer |
Kim J. Blackwell, Allan R. Knoll, Luis J. Matienzo, Richard D. Weale |
2001-05-22 |
$28,959,000 |
| 6132813 |
High density plasma surface modification for improving antiwetting properties |
Richard Hsiao, Son V. Nguyen, Andrew C. Ting |
2000-10-17 |
$30,556,000 |
| 6117283 |
Silicon coating on air bearing surface for magnetic thin film heads |
Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons |
2000-09-12 |
$33,772,000 |
| 6023840 |
Method of manufacturing a thin film magnetic head having an ultrathin silicon wear coating |
Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons |
2000-02-15 |
$27,373,000 |
| 5943187 |
Carbon overcoat for a slider with improved step coverage |
Cherngye Hwang, Vedantham Raman, Jila Tabib |
1999-08-24 |
$33,463,000 |
| 5808832 |
Ultrathin silicon wear coating for a slider and thin film magnetic head elements at an ABS |
Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons |
1998-09-15 |
$10,805,000 |
| 5525369 |
Method for metallizing through holes in thin film substrates, and resulting devices |
Kim J. Blackwell, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale |
1996-06-11 |
$10,629,000 |
| 5461203 |
Electronic package including lower water content polyimide film |
Kim J. Blackwell, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo |
1995-10-24 |
$10,910,000 |
| 5306741 |
Method of laminating polyimide to thin sheet metal |
Thomas E. Kindl, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie |
1994-04-26 |
$7,965,000 |
| 5288541 |
Method for metallizing through holes in thin film substrates, and resulting devices |
Kim J. Blackwell, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale |
1994-02-22 |
$8,202,000 |
| 5156710 |
Method of laminating polyimide to thin sheet metal |
Thomas E. Kindl, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie |
1992-10-20 |
$9,947,000 |
| 5128008 |
Method of forming a microelectronic package having a copper substrate |
Richard D. Weale |
1992-07-07 |
$9,389,000 |
