PC

Pei C. Chen

IBM: 14 patents #8,004 of 70,183Top 15%
HG HGST: 4 patents #567 of 1,677Top 35%
Overall (All Time): #259,129 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7846305 Method and apparatus for increasing uniformity in ion mill process Omar Eduardo Montero Camacho, Laurence S. Samuelson, Yongjian Sun 2010-12-07
7560225 Method of forming uniform features using photoresist Omar Eduardo Montero Camacho, Cherngye Hwang, Diana Perez, Eric Sun 2009-07-14
7481312 Direct cooling pallet assembly for temperature stability for deep ion mill etch process Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun 2009-01-27
7296420 Direct cooling pallet tray for temperature stability for deep ion mill etch process Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun 2007-11-20
6532134 Silicon coating on air bearing surface for magnetic thin film heads Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons 2003-03-11
6337004 High adhesion performance roll sputtered strike layer Kim J. Blackwell, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo 2002-01-08
6235411 Process for coating a substrate with metallic layer Kim J. Blackwell, Allan R. Knoll, Luis J. Matienzo, Richard D. Weale 2001-05-22
6132813 High density plasma surface modification for improving antiwetting properties Richard Hsiao, Son V. Nguyen, Andrew C. Ting 2000-10-17
6117283 Silicon coating on air bearing surface for magnetic thin film heads Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons 2000-09-12
6023840 Method of manufacturing a thin film magnetic head having an ultrathin silicon wear coating Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons 2000-02-15
5943187 Carbon overcoat for a slider with improved step coverage Cherngye Hwang, Vedantham Raman, Jila Tabib 1999-08-24
5808832 Ultrathin silicon wear coating for a slider and thin film magnetic head elements at an ABS Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons 1998-09-15
5525369 Method for metallizing through holes in thin film substrates, and resulting devices Kim J. Blackwell, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale 1996-06-11
5461203 Electronic package including lower water content polyimide film Kim J. Blackwell, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo 1995-10-24
5306741 Method of laminating polyimide to thin sheet metal Thomas E. Kindl, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie 1994-04-26
5288541 Method for metallizing through holes in thin film substrates, and resulting devices Kim J. Blackwell, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale 1994-02-22
5156710 Method of laminating polyimide to thin sheet metal Thomas E. Kindl, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie 1992-10-20
5128008 Method of forming a microelectronic package having a copper substrate Richard D. Weale 1992-07-07