Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846305 | Method and apparatus for increasing uniformity in ion mill process | Omar Eduardo Montero Camacho, Laurence S. Samuelson, Yongjian Sun | 2010-12-07 |
| 7560225 | Method of forming uniform features using photoresist | Omar Eduardo Montero Camacho, Cherngye Hwang, Diana Perez, Eric Sun | 2009-07-14 |
| 7481312 | Direct cooling pallet assembly for temperature stability for deep ion mill etch process | Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun | 2009-01-27 |
| 7296420 | Direct cooling pallet tray for temperature stability for deep ion mill etch process | Jorge Goitia, Cherngye Hwang, Bigal Leung, Diana Perez, Yongjian Sun | 2007-11-20 |
| 6532134 | Silicon coating on air bearing surface for magnetic thin film heads | Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons | 2003-03-11 |
| 6337004 | High adhesion performance roll sputtered strike layer | Kim J. Blackwell, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo | 2002-01-08 |
| 6235411 | Process for coating a substrate with metallic layer | Kim J. Blackwell, Allan R. Knoll, Luis J. Matienzo, Richard D. Weale | 2001-05-22 |
| 6132813 | High density plasma surface modification for improving antiwetting properties | Richard Hsiao, Son V. Nguyen, Andrew C. Ting | 2000-10-17 |
| 6117283 | Silicon coating on air bearing surface for magnetic thin film heads | Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons | 2000-09-12 |
| 6023840 | Method of manufacturing a thin film magnetic head having an ultrathin silicon wear coating | Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons | 2000-02-15 |
| 5943187 | Carbon overcoat for a slider with improved step coverage | Cherngye Hwang, Vedantham Raman, Jila Tabib | 1999-08-24 |
| 5808832 | Ultrathin silicon wear coating for a slider and thin film magnetic head elements at an ABS | Grace Gorman, Cherngye Hwang, Vedantham Raman, Randall George Simmons | 1998-09-15 |
| 5525369 | Method for metallizing through holes in thin film substrates, and resulting devices | Kim J. Blackwell, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale | 1996-06-11 |
| 5461203 | Electronic package including lower water content polyimide film | Kim J. Blackwell, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo | 1995-10-24 |
| 5306741 | Method of laminating polyimide to thin sheet metal | Thomas E. Kindl, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie | 1994-04-26 |
| 5288541 | Method for metallizing through holes in thin film substrates, and resulting devices | Kim J. Blackwell, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale | 1994-02-22 |
| 5156710 | Method of laminating polyimide to thin sheet metal | Thomas E. Kindl, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie | 1992-10-20 |
| 5128008 | Method of forming a microelectronic package having a copper substrate | Richard D. Weale | 1992-07-07 |