Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-06-10 |
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-02-18 |
| 5435732 | Flexible circuit member | Christopher G. Angulas, Patrick T. Flynn, Joseph Funari, Randy L. Orr | 1995-07-25 |
| 5334487 | Method for forming a patterned layer on a substrate | Ronald J. Moore, Paul George Rickerl | 1994-08-02 |
| 5306741 | Method of laminating polyimide to thin sheet metal | Pei C. Chen, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie | 1994-04-26 |
| 5278724 | Electronic package and method of making same | Christopher G. Angulas | 1994-01-11 |
| 5261155 | Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders | Christopher G. Angulas, Patrick T. Flynn, Joseph Funari, Randy L. Orr | 1993-11-16 |
| 5203075 | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders | Christopher G. Angulas, Patrick T. Flynn, Joseph Funari, Randy L. Orr | 1993-04-20 |
| 5156710 | Method of laminating polyimide to thin sheet metal | Pei C. Chen, Paul George Rickerl, Mark J. Schadt, John Gregory Stephanie | 1992-10-20 |
| 5145553 | Method of making a flexible circuit member | Stanley M. Albrechta, Robert J. Clementi | 1992-09-08 |
| 5133495 | Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween | Christopher G. Angulas, Patrick T. Flynn | 1992-07-28 |
| 4911786 | Method of etching polyimides and resulting passivation structure | Paul George Rickerl, David J. Russell | 1990-03-27 |