Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package and method of making same

Electronic package and method of making same

US Patent 5278724 · Granted Jan 11, 1994

Estimated economic value: $8,526,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fabrication of a metalized blind via2003
Fabrication of a metalized blind via2003
Flexible circuit member1995
Flexible circuit member1995
Electronic package structure and method of making same1994
Method for forming a patterned layer on a substrate1994
Method of laminating polyimide to thin sheet metal1994
Method for bonding flexible circuit to circuitized substrate to provide electric1993
Method for bonding flexible circuit to circuitized substrate to provide electric1993
Method of bonding flexible circuit to cicuitized substrate to provide electrical1993
Method of bonding flexible circuit to cicuitized substrate to provide electrical1993
Method of laminating polyimide to thin sheet metal1992