Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7576968 | Plated terminations and method of forming using electrolytic plating | Andrew P. Ritter, Robert H. Heistand, II, John L. Galvagni, John M. Hulik | 2009-08-18 |
| 7463474 | System and method of plating ball grid array and isolation features for electronic components | Andrew P. Ritter, John L. Galvagni | 2008-12-09 |
| 7378227 | Method of making a printed wiring board with conformally plated circuit traces | Edmond O. Fey, Thomas R. Miller, Anita Sargent | 2008-05-27 |
| 7084509 | Electronic package with filled blinds vias | Frank D. Egitto, Elizabeth Foster, Voya R. Markovich, Manh-Quan Nguyen | 2006-08-01 |
| 6935018 | Copper plated invar with acid preclean | Bonnie McClure, Craig W. Richards | 2005-08-30 |
| 6924224 | Method of forming filled blind vias | Frank D. Egitto, Elizabeth Foster, Voya R. Markovich, Manh-Quan Nguyen | 2005-08-02 |
| 6852152 | Colloidal seed formulation for printed circuit board metallization | Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller, Anita Sargent, William E. Wilson | 2005-02-08 |
| 6815126 | Printed wiring board with conformally plated circuit traces | Edmond O. Fey, Thomas R. Miller, Anita Sargent | 2004-11-09 |
| 6626196 | Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing | Francis J. Downes, Jr., Lawrence P. Lehman, Robert D. Topa | 2003-09-30 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Donald S. Farquhar, Sung Kwon Kang, Mark D. Poliks, Chandrika Prasad, Roy Yu | 2003-07-29 |
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, David E. Houser, Mark L. Janecek, Thomas E. Kindl +7 more | 2003-06-10 |
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, David E. Houser, Mark L. Janecek, Thomas E. Kindl +7 more | 2003-02-18 |
| 6518509 | Copper plated invar with acid preclean | Bonnie McClure, Craig W. Richards | 2003-02-11 |
| 6228246 | Removal of metal skin from a copper-Invar-copper laminate | Madhav Datta, Lawrence P. Lehman, Roy H. Magnuson, Robin A. Susko, Robert D. Topa | 2001-05-08 |
| 6179990 | Biased acid cleaning of a copper-invar-copper laminate | Lawrence P. Lehman, Roy H. Magnuson, Robert D. Topa | 2001-01-30 |
| 6176985 | Laminated electroplating rack and connection system for optimized plating | Francis J. Downes, Jr., Robert M. Japp, John Frank Surowka | 2001-01-23 |
| 6043150 | Method for uniform plating of dendrites | Francis J. Downes, Jr., Jaynal A. Molla | 2000-03-28 |
| 5939786 | Uniform plating of dendrites | Francis J. Downes, Jr., Jaynal A. Molla | 1999-08-17 |
| 5472735 | Method for forming electrical connection to the inner layers of a multilayer circuit board | Christina M. Boyko, Richard W. Carpenter, Krystyna W. Semkow, Herbert Wegener | 1995-12-05 |
| 5432998 | Method of solder bonding processor package | Jaynal A. Molla | 1995-07-18 |
| 5374338 | Selective electroetch of copper and other metals | Christina M. Boyko, Richard W. Carpenter, Krystyna W. Semkow, Herbert Wegener | 1994-12-20 |
| 4540473 | Copper plating bath having increased plating rate, and method | Perminder S. Bindra, Allan P. David, Charles E. Gasdik, David N. Light, Paul B. Pickar | 1985-09-10 |
| 4479852 | Method for determination of concentration of organic additive in plating bath | Perminder S. Bindra, Allan P. David, David N. Light | 1984-10-30 |