RT

Robert D. Topa

IBM: 10 patents #10,888 of 70,183Top 20%
Overall (All Time): #524,538 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6626196 Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing Francis J. Downes, Jr., Raymond T. Galasco, Lawrence P. Lehman 2003-09-30
6228246 Removal of metal skin from a copper-Invar-copper laminate Madhav Datta, Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson, Robin A. Susko 2001-05-08
6179990 Biased acid cleaning of a copper-invar-copper laminate Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson 2001-01-30
5242569 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley 1993-09-07
5237743 Method of forming a conductive end portion on a flexible circuit member Raymond A. Busacco, Fletcher W. Chapin, David W. Dranchak, Jaynal A. Molla, George J. Saxenmeyer, Jr. 1993-08-24
5148261 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley 1992-09-15
5135155 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley 1992-08-04
5120418 Lead frame plating apparatus for thermocompression bonding Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley 1992-06-09
5006917 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley 1991-04-09
4564426 Process for the deposition of palladium-nickel alloy Timothy P. Henning 1986-01-14