Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6626196 | Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing | Francis J. Downes, Jr., Raymond T. Galasco, Lawrence P. Lehman | 2003-09-30 |
| 6228246 | Removal of metal skin from a copper-Invar-copper laminate | Madhav Datta, Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson, Robin A. Susko | 2001-05-08 |
| 6179990 | Biased acid cleaning of a copper-invar-copper laminate | Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson | 2001-01-30 |
| 5242569 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley | 1993-09-07 |
| 5237743 | Method of forming a conductive end portion on a flexible circuit member | Raymond A. Busacco, Fletcher W. Chapin, David W. Dranchak, Jaynal A. Molla, George J. Saxenmeyer, Jr. | 1993-08-24 |
| 5148261 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley | 1992-09-15 |
| 5135155 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley | 1992-08-04 |
| 5120418 | Lead frame plating apparatus for thermocompression bonding | Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley | 1992-06-09 |
| 5006917 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Timothy C. Reiley | 1991-04-09 |
| 4564426 | Process for the deposition of palladium-nickel alloy | Timothy P. Henning | 1986-01-14 |