Robert D. Topa has been granted 10 US patents while listed as an inventor at IBM . The first was granted in 1986 and the most recent in September 2003. Robert D. Topa ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Robert D. Topa in Binghamton, NY, US.
Patents per Year Patents granted per year, 1986 to 2003 Bar chart with a peak of 3 patents in 1992. peak 3 1986: 1 patents 1986 1991: 1 patents 1991 1992: 3 patents 1992 1993: 2 patents 1993 2001: 2 patents 2001 2003: 1 patents 2003
Issued Patents All Time
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Showing 1–10 of 10 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
6626196 Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing Francis J. Downes, Jr. , Raymond T. Galasco , Lawrence P. Lehman 2003-09-30
$10,221,000
6228246 Removal of metal skin from a copper-Invar-copper laminate Madhav Datta , Raymond T. Galasco , Lawrence P. Lehman , Roy H. Magnuson , Robin A. Susko 2001-05-08
$26,391,000
6179990 Biased acid cleaning of a copper-invar-copper laminate Raymond T. Galasco , Lawrence P. Lehman , Roy H. Magnuson 2001-01-30
$13,187,000
5242569 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang , Michael J. Palmer , Timothy C. Reiley 1993-09-07
$11,159,000
5237743 Method of forming a conductive end portion on a flexible circuit member Raymond A. Busacco , Fletcher W. Chapin , David W. Dranchak , Jaynal A. Molla , George J. Saxenmeyer, Jr. 1993-08-24
$7,496,000
5148261 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang , Michael J. Palmer , Timothy C. Reiley 1992-09-15
$12,539,000
5135155 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang , Michael J. Palmer , Timothy C. Reiley 1992-08-04
$10,228,000
5120418 Lead frame plating apparatus for thermocompression bonding Sung Kwon Kang , Michael J. Palmer , Timothy C. Reiley 1992-06-09
$7,952,000
5006917 Thermocompression bonding in integrated circuit packaging Sung Kwon Kang , Michael J. Palmer , Timothy C. Reiley 1991-04-09
$15,031,000
4564426 Process for the deposition of palladium-nickel alloy Timothy P. Henning 1986-01-14
$33,933,000
