{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Thermocompression bonding in integrated circuit packaging", "item": "https://www.patentleaderboard.com/patent/5242569"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermocompression bonding in integrated circuit packaging

Thermocompression bonding in integrated circuit packaging

US Patent 5242569 · Granted Sep 7, 1993

Estimated economic value: $11,159,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stent having exterior path2018
Cardiac valve fixing device2018
Substrate via filling2018
Substrate via filling2016
Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn2015
Prevention and control of intermetallic alloy inclusions that form during reflow2014
Multipath soldered thermal interface between a chip and its heat sink2014
Prevention and control of intermetallic alloy inclusions2014
Magnetoresistive sensor having a structure for activating and deactivating elect2014
Laser power sensor for thermally assisted magnetic recording2013
Interconnections for flip-chip using lead-free solders and having improved react2012
Magnetoresistive sensor having a structure for activating and deactivating elect2012