Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

US Patent 9082762 · Granted Jul 14, 2015

Estimated economic value: $7,900,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antimicrobial bandage with nanostructures2024
Optical sensor system for quantitative colorimetric liquid analysis2023
Ultrasonic-assisted solder transfer2023
Ultrasonic-assisted solder transfer2023
Accurate colorimetric based test strip reader system2022
Analysis apparatus with spectrometer2022
Strain gauge structure for a sensor2022
Combination polyimide decal with a rigid mold2022
Combination polyimide decal with a rigid mold2022
Interconnect crack arrestor structure and methods2022
Low-profile battery construct with engineered interfaces2021
Continuous solder transfer to substrates2021