Issued Patents All Time
Showing 25 most recent of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11541472 | Ultrasonic-assisted solder transfer | Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2023-01-03 |
| 11270966 | Combination polyimide decal with a rigid mold | Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2022-03-08 |
| 11183725 | Low-profile battery construct with engineered interfaces | Paul S. Andry, Jae-Woong Nah, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2021-11-23 |
| 11110534 | Continuous solder transfer to substrates | Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2021-09-07 |
| 10892333 | Method of making a gallium nitride device | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2021-01-12 |
| 10581037 | Low-profile battery construct with engineered interfaces | Paul S. Andry, Jae-Woong Nah, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2020-03-03 |
| 10424644 | Method of making a gallium nitride device | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2019-09-24 |
| 10249792 | Protective capping layer for spalled gallium nitride | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2019-04-02 |
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Jae-Woong Nah | 2018-12-04 |
| 10026618 | Method for improving quality of spalled material layers | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more | 2018-07-17 |
| 10020418 | Simplified process for vertical LED manufacturing | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2018-07-10 |
| 9929313 | Protective capping layer for spalled gallium nitride | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2018-03-27 |
| 9918382 | Patterned metallization handle layer for controlled spalling | Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2018-03-13 |
| 9748353 | Method of making a gallium nitride device | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2017-08-29 |
| 9722039 | Fabricating high-power devices | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2017-08-01 |
| 9713250 | Patterned metallization handle layer for controlled spalling | Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2017-07-18 |
| 9578736 | Patterned metallization handle layer for controlled spalling | Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2017-02-21 |
| 9570295 | Protective capping layer for spalled gallium nitride | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2017-02-14 |
| 9564335 | Method for improving quality of spalled material layers | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more | 2017-02-07 |
| 9502278 | Substrate holder assembly for controlled layer transfer | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2016-11-22 |
| 9502609 | Simplified process for vertical LED manufacturing | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2016-11-22 |
| 9455180 | Controlled spalling of fine features | Stephen W. Bedell, Ning Li, Devendra K. Sadana | 2016-09-27 |
| 9404942 | Coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2016-08-02 |
| 9308714 | Method for improving surface quality of spalled substrates | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2016-04-12 |
| 9295166 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Jae-Woong Nah | 2016-03-22 |