Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2014-03-18 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2013-05-21 |
| 7795724 | Sandwiched organic LGA structure | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, David L. Questad | 2010-09-14 |
| 7709951 | Thermal pillow | William L. Brodsky, Peter J. Brofman, James A. Busby, Bruce J. Chamberlin, Scott Cummings +6 more | 2010-05-04 |
| 7255571 | Temperature dependent semiconductor module connectors | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, James R. Wilcox | 2007-08-14 |
| 7137826 | Temperature dependent semiconductor module connectors | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, James R. Wilcox | 2006-11-21 |
| 7128579 | Hook interconnect | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, James R. Wilcox | 2006-10-31 |
| 6569711 | Methods and apparatus for balancing differences in thermal expansion in electronic packaging | James Warren Wilson | 2003-05-27 |
| 6228246 | Removal of metal skin from a copper-Invar-copper laminate | Madhav Datta, Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson, Robert D. Topa | 2001-05-08 |
| 6177728 | Integrated circuit chip device having balanced thermal expansion | James Warren Wilson | 2001-01-23 |
| 6059579 | Semiconductor structure interconnector and assembly | John S. Kresge, Scott P. Moore, James Warren Wilson | 2000-05-09 |
| 5956235 | Method and apparatus for flexibly connecting electronic devices | John S. Kresge, James Warren Wilson | 1999-09-21 |
| 5208067 | Surface modification of organic materials to improve adhesion | Carol R. Jones | 1993-05-04 |
| 5189261 | Electrical and/or thermal interconnections and methods for obtaining such | Lawrence C. Alexander, Bernd Karl Appelt, David K. Balkin, James Jens Hansen, Joseph Hromek +5 more | 1993-02-23 |
| 5039569 | Surface modification of organic materials to improve adhesion | Carol R. Jones | 1991-08-13 |
| 4908094 | Method for laminating organic materials via surface modification | Carol R. Jones | 1990-03-13 |
| 4885074 | Plasma reactor having segmented electrodes | James Warren Wilson | 1989-12-05 |
| 4830706 | Method of making sloped vias | Ronald S. Horwath, John R. Susko | 1989-05-16 |
| 4715941 | Surface modification of organic materials to improve adhesion | Carol R. Jones | 1987-12-29 |
| 4654115 | Process for removing contaminant | Frank D. Egitto, Francis Emmi, Walter E. Mlynko | 1987-03-31 |