| 7737550 |
Optimization of electronic package geometry for thermal dissipation |
Stephen W. MacQuarrie |
2010-06-15 |
| 6259037 |
Polytetrafluoroethylene thin film chip carrier |
Natalie B. Feilchenfeld, John S. Kresge, Ronald Peter Nowak, James Warren Wilson |
2001-07-10 |
| 6059579 |
Semiconductor structure interconnector and assembly |
John S. Kresge, Robin A. Susko, James Warren Wilson |
2000-05-09 |
| 6006428 |
Polytetrafluoroethylene thin film chip carrier |
Natalie B. Feilchenfeld, John S. Kresge, Ronald Peter Nowak, James Warren Wilson |
1999-12-28 |
| 5798563 |
Polytetrafluoroethylene thin film chip carrier |
Natalie B. Feilchenfeld, John S. Kresge, Ronald Peter Nowak, James Warren Wilson |
1998-08-25 |
| 5768774 |
Thermally enhanced ball grid array package |
James Warren Wilson, Stephen R. Engle |
1998-06-23 |
| 5572405 |
Thermally enhanced ball grid array package |
James Warren Wilson, Stephen R. Engle |
1996-11-05 |
| 5288944 |
Pinned ceramic chip carrier |
Lance A. Bronson, John Andrew Shriver, III |
1994-02-22 |
| 5243133 |
Ceramic chip carrier with lead frame or edge clip |
Stephen R. Engle, Mukund Kantilal Saraiya |
1993-09-07 |
