| 6655020 |
Method of packaging a high performance chip |
Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Randall J. Stutzman, George H. Thiel |
2003-12-02 |
| 6552264 |
High performance chip packaging and method |
Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Randall J. Stutzman, George H. Thiel |
2003-04-22 |
| 6552266 |
High performance chip packaging and method |
Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Randall J. Stutzman, George H. Thiel |
2003-04-22 |
| 5768774 |
Thermally enhanced ball grid array package |
James Warren Wilson, Scott P. Moore |
1998-06-23 |
| 5572405 |
Thermally enhanced ball grid array package |
James Warren Wilson, Scott P. Moore |
1996-11-05 |
| 5243133 |
Ceramic chip carrier with lead frame or edge clip |
Scott P. Moore, Mukund Kantilal Saraiya |
1993-09-07 |
| 4803100 |
Suspension and use thereof |
Joseph G. Ameen, Timothy F. Carden, Lawrence R. Cutting, Ronald J. Moore |
1989-02-07 |
