Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6655020 | Method of packaging a high performance chip | Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman, George H. Thiel | 2003-12-02 |
| 6552264 | High performance chip packaging and method | Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman, George H. Thiel | 2003-04-22 |
| 6552266 | High performance chip packaging and method | Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman, George H. Thiel | 2003-04-22 |
| 6538213 | High density design for organic chip carriers | Todd W. Davies, Ross W. Keesler, Robert David Sebesta, David B. Stone, Cheryl L. Tytran-Palomaki | 2003-03-25 |
| 6488806 | Assembly process for flip chip package having a low stress chip and resulting structure | Aleksander Zubelewicz | 2002-12-03 |
| 6224711 | Assembly process for flip chip package having a low stress chip and resulting structure | Aleksander Zubelewicz | 2001-05-01 |
| 4803100 | Suspension and use thereof | Joseph G. Ameen, Lawrence R. Cutting, Stephen R. Engle, Ronald J. Moore | 1989-02-07 |