Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7098136 | Structure having flush circuit features and method of making | Ronald Clothier, Jeffrey Alan Knight | 2006-08-29 |
| 7024764 | Method of making an electronic package | John S. Kresge, David B. Stone, James R. Wilcox | 2006-04-11 |
| 6989297 | Variable thickness pads on a substrate surface | James Warren Wilson | 2006-01-24 |
| 6900545 | Variable thickness pads on a substrate surface | James Warren Wilson | 2005-05-31 |
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2004-12-14 |
| 6815709 | Structure having flush circuitry features and method of making | Ronald Clothier, Jeffrey Alan Knight | 2004-11-09 |
| 6618940 | Fine pitch circuitization with filled plated through holes | Kenneth J. Lubert, Curtis Miller, Thomas R. Miller, James Warren Wilson, Michael Wozniak | 2003-09-16 |
| 6580491 | Apparatus and method for compensating for distortion of a printed circuit workpiece substrate | Richard R. Hall, Robert Lee Lewis, JR., How T. Lin, Peter M. Nichols | 2003-06-17 |
| 6580494 | Method and system of distortion compensation in a projection imaging expose system | Richard R. Hall, Robert Lee Lewis, JR., How T. Lin, Peter M. Nichols | 2003-06-17 |
| 6538213 | High density design for organic chip carriers | Timothy F. Carden, Todd W. Davies, Ross W. Keesler, David B. Stone, Cheryl L. Tytran-Palomaki | 2003-03-25 |
| 6429113 | Method for connecting an electrical device to a circuit substrate | Robert Lee Lewis, JR., Daniel Martin Waits | 2002-08-06 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2002-04-16 |
| 6351393 | Electronic package for electronic components and method of making same | John S. Kresge, David B. Stone, James R. Wilcox | 2002-02-26 |
| 6291779 | Fine pitch circuitization with filled plated through holes | Kenneth J. Lubert, Curtis Miller, Thomas R. Miller, James Warren Wilson, Michael Wozniak | 2001-09-18 |
| 6077766 | Variable thickness pads on a substrate surface | James Warren Wilson | 2000-06-20 |
| 6014809 | Method for circuitizing over an edge of a circuit card | — | 2000-01-18 |
| 6013417 | Process for fabricating circuitry on substrates having plated through-holes | James Warren Wilson | 2000-01-11 |
| 5858254 | Multilayered circuitized substrate and method of fabrication | Peter Balzer, Robert Lee Lewis, JR. | 1999-01-12 |
| 5712192 | Process for connecting an electrical device to a circuit substrate | Robert Lee Lewis, JR., Daniel Martin Waits | 1998-01-27 |
| 5612573 | Electronic package with multilevel connections | Robert Lee Lewis, JR., Daniel Martin Waits | 1997-03-18 |
| 5505320 | Method employing laser ablating for providing a pattern on a substrate | Francis Charles Burns, Robert Lee Lewis, JR., Steven W. Opie | 1996-04-09 |