| 7098136 |
Structure having flush circuit features and method of making |
Ronald Clothier, Jeffrey Alan Knight |
2006-08-29 |
| 7024764 |
Method of making an electronic package |
John S. Kresge, David B. Stone, James R. Wilcox |
2006-04-11 |
| 6989297 |
Variable thickness pads on a substrate surface |
James Warren Wilson |
2006-01-24 |
| 6900545 |
Variable thickness pads on a substrate surface |
James Warren Wilson |
2005-05-31 |
| 6829823 |
Method of making a multi-layered interconnect structure |
Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more |
2004-12-14 |
| 6815709 |
Structure having flush circuitry features and method of making |
Ronald Clothier, Jeffrey Alan Knight |
2004-11-09 |
| 6618940 |
Fine pitch circuitization with filled plated through holes |
Kenneth J. Lubert, Curtis Miller, Thomas R. Miller, James Warren Wilson, Michael Wozniak |
2003-09-16 |
| 6580491 |
Apparatus and method for compensating for distortion of a printed circuit workpiece substrate |
Richard R. Hall, Robert Lee Lewis, JR., How T. Lin, Peter M. Nichols |
2003-06-17 |
| 6580494 |
Method and system of distortion compensation in a projection imaging expose system |
Richard R. Hall, Robert Lee Lewis, JR., How T. Lin, Peter M. Nichols |
2003-06-17 |
| 6538213 |
High density design for organic chip carriers |
Timothy F. Carden, Todd W. Davies, Ross W. Keesler, David B. Stone, Cheryl L. Tytran-Palomaki |
2003-03-25 |
| 6429113 |
Method for connecting an electrical device to a circuit substrate |
Robert Lee Lewis, JR., Daniel Martin Waits |
2002-08-06 |
| 6373717 |
Electronic package with high density interconnect layer |
Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more |
2002-04-16 |
| 6351393 |
Electronic package for electronic components and method of making same |
John S. Kresge, David B. Stone, James R. Wilcox |
2002-02-26 |
| 6291779 |
Fine pitch circuitization with filled plated through holes |
Kenneth J. Lubert, Curtis Miller, Thomas R. Miller, James Warren Wilson, Michael Wozniak |
2001-09-18 |
| 6077766 |
Variable thickness pads on a substrate surface |
James Warren Wilson |
2000-06-20 |
| 6014809 |
Method for circuitizing over an edge of a circuit card |
— |
2000-01-18 |
| 6013417 |
Process for fabricating circuitry on substrates having plated through-holes |
James Warren Wilson |
2000-01-11 |
| 5858254 |
Multilayered circuitized substrate and method of fabrication |
Peter Balzer, Robert Lee Lewis, JR. |
1999-01-12 |
| 5712192 |
Process for connecting an electrical device to a circuit substrate |
Robert Lee Lewis, JR., Daniel Martin Waits |
1998-01-27 |
| 5612573 |
Electronic package with multilevel connections |
Robert Lee Lewis, JR., Daniel Martin Waits |
1997-03-18 |
| 5505320 |
Method employing laser ablating for providing a pattern on a substrate |
Francis Charles Burns, Robert Lee Lewis, JR., Steven W. Opie |
1996-04-09 |
