Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6887779 | Integrated circuit structure | David J. Alcoe, Francis J. Downes, Jr., John S. Kresge, Cheryl L. Tytran-Palomaki | 2005-05-03 |
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, John S. Kresge +3 more | 2004-12-14 |
| 6739048 | Process of fabricating a circuitized structure | Ross W. Keesler, Voya R. Markovich, William J. Rudik, James Warren Wilson, William E. Wilson | 2004-05-25 |
| 6720502 | Integrated circuit structure | David J. Alcoe, Francis J. Downes, Jr., John S. Kresge, Cheryl L. Tytran-Palomaki | 2004-04-13 |
| 6680440 | Circuitized structures produced by the methods of electroless plating | David J. Russell, Heike Marcello, Voya R. Markovich | 2004-01-20 |
| 6593534 | Printed wiring board structure with z-axis interconnections | John M. Lauffer, Voya R. Markovich, Thomas R. Miller, James P. Paoletti, Konstantinos I. Papathomas +1 more | 2003-07-15 |
| 6447914 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure | Anastasios Angelopoulos, Luis J. Matienzo, Thomas R. Miller, William D. Taylor | 2002-09-10 |
| 6420253 | Method for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gary Johansson, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2002-07-16 |
| 6376158 | Methods for selectively filling apertures | Heike Marcello, Kostas Papathomas | 2002-04-23 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, John S. Kresge +3 more | 2002-04-16 |
| 6252307 | Structure for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gary Johansson, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2001-06-26 |
| 6136513 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure | Anastasios Angelopoulos, Luis J. Matienzo, Thomas R. Miller, William D. Taylor | 2000-10-24 |
| 6131279 | Integrated manufacturing packaging process | Ross W. Keesler, Voya R. Markovich, William J. Rudik, James Warren Wilson, William E. Wilson | 2000-10-17 |
| 6127097 | Photoresist develop and strip solvent compositions and method for their use | Nageshwer Rao Bantu, Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Joseph Alphonse Kotylo, Robert J. Owen +2 more | 2000-10-03 |
| 6066889 | Methods of selectively filling apertures | Heike Marcello, Kostas Papathomas | 2000-05-23 |
| 6027858 | Process for tenting PTH's with PID dry film | Ross W. Keesler, Voya R. Markovich, Heinke Marcello, James Warren Wilson, William E. Wilson | 2000-02-22 |
| 6025057 | Organic electronic package and method of applying palladium-tin seed layer thereto | Anastasios Angelopoulos, Richard William Malek, Heike Marcello, Jeffrey McKeveny | 2000-02-15 |
| 5997997 | Method for reducing seed deposition in electroless plating | Anastasios Angelopoulos, Luis J. Matienzo, Thomas R. Miller, Voya R. Markovich | 1999-12-07 |
| 5935652 | Method for reducing seed deposition in electroless plating | Anastasios Angelopoulos, Luis J. Matienzo, Thomas R. Miller, Voya R. Markovich | 1999-08-10 |
| 5922517 | Method of preparing a substrate surface for conformal plating | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Voya R. Markovich, William E. Wilson | 1999-07-13 |
| 5905018 | Method of preparing a substrate surface for conformal plating | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Voya R. Markovich, William E. Wilson | 1999-05-18 |
| 5866237 | Organic electronic package and method of applying palladium-tin seed layer thereto | Anastasios Angelopoulos, Richard William Malek, Heike Marcello, Jeffrey McKeveny | 1999-02-02 |
| 5789121 | High density template: materials and processes for the application of conductive pastes | Douglas A. Cywar, Charles R. Davis, Thomas P. Duffy, Frank D. Egitto, Paul Joseph Hart +1 more | 1998-08-04 |
| 5599747 | Method of making circuitized substrate | Ashwinkumar C. Bhatt, Thomas P. Duffy, David E. Houser, Jeffrey McKeveny, Kenneth Lynn Potter | 1997-02-04 |
| 5460921 | High density pattern template: materials and processes for the application of conductive pastes | Douglas A. Cywar, Charles R. Davis, Thomas P. Duffy, Frank D. Egitto, Paul Joseph Hart +1 more | 1995-10-24 |