AA

Anastasios Angelopoulos

IBM: 8 patents #13,150 of 70,183Top 20%
General Motors: 5 patents #3,082 of 18,328Top 20%
UC University Of Cincinnati: 4 patents #33 of 791Top 5%
Overall (All Time): #253,110 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11478164 Water and salt resistant solid super-acid catalysts Jonathan A. Bernstein 2022-10-25
10418641 High activity Pt—Bi catalyst for dimethyl ether electro-oxidation 2019-09-17
9921167 Optical sensor based on PFSI membrane comprising associated benzene-1,3-diol for detecting target compounds, and method thereof Subasri M Ayyadurai, Jonathan A. Bernstein, Daniel S. Kanter 2018-03-20
9640805 Coating process for fuel cell components Scott Lawrence Peters 2017-05-02
8628819 Method of depositing a nanoparticle coating on a bipolar plate and removing the nanoparticle coating from the lands of the bipolar plate Scott Lawrence Peters 2014-01-14
8435627 Multifunctional nanocoatings with mixed nanoparticles and process for fabricating same 2013-05-07
8227076 Multifunctional nanocoatings and process for fabricating same 2012-07-24
7892596 Nanoparticle coating process for fuel cell components Scott Lawrence Peters 2011-02-22
7132191 Addressing one MEA failure mode by controlling MEA catalyst layer overlap John Healy, Clark G. Hochgraf 2006-11-07
7105242 Control of polymer surface distribution on diffusion media improved fuel cell performance Chunxin Ji, Mark Mathias 2006-09-12
6908684 Promoting adhesion between a polymer and a metallic substrate Stephen Joseph Fuerniss, Joseph Alphonse Kotylo, Luis J. Matienzo, Norman L. Shaver 2005-06-21
6730409 Promoting adhesion between a polymer and a metallic substrate Stephen Joseph Fuerniss, Joseph Alphonse Kotylo, Luis J. Matienzo, Norman L. Shaver 2004-05-04
6447914 Method of uniformly depositing seed and a conductor and the resultant printed circuit structure Gerald W. Jones, Luis J. Matienzo, Thomas R. Miller, William D. Taylor 2002-09-10
6136513 Method of uniformly depositing seed and a conductor and the resultant printed circuit structure Gerald W. Jones, Luis J. Matienzo, Thomas R. Miller, William D. Taylor 2000-10-24
6025057 Organic electronic package and method of applying palladium-tin seed layer thereto Gerald W. Jones, Richard William Malek, Heike Marcello, Jeffrey McKeveny 2000-02-15
5997997 Method for reducing seed deposition in electroless plating Gerald W. Jones, Luis J. Matienzo, Thomas R. Miller, Voya R. Markovich 1999-12-07
5935652 Method for reducing seed deposition in electroless plating Gerald W. Jones, Luis J. Matienzo, Thomas R. Miller, Voya R. Markovich 1999-08-10
5866237 Organic electronic package and method of applying palladium-tin seed layer thereto Gerald W. Jones, Richard William Malek, Heike Marcello, Jeffrey McKeveny 1999-02-02