| 6835533 |
Photoimageable dielectric epoxy resin system film |
Elizabeth Foster, Gary Johansson, David J. Russell |
2004-12-28 |
| 6706464 |
Method of fabricating circuitized structures |
Elizabeth Foster, Gary Johansson, David J. Russell |
2004-03-16 |
| 6680440 |
Circuitized structures produced by the methods of electroless plating |
David J. Russell, Gerald W. Jones, Voya R. Markovich |
2004-01-20 |
| 6528218 |
Method of fabricating circuitized structures |
Elizabeth Foster, Gary Johansson, David J. Russell |
2003-03-04 |
| 6519843 |
Method of forming a chip carrier by joining a laminate layer and stiffener |
John M. Lauffer, David J. Russell |
2003-02-18 |
| 6376158 |
Methods for selectively filling apertures |
Gerald W. Jones, Kostas Papathomas |
2002-04-23 |
| 6195264 |
Laminate substrate having joining layer of photoimageable material |
John M. Lauffer, David J. Russell |
2001-02-27 |
| 6066889 |
Methods of selectively filling apertures |
Gerald W. Jones, Kostas Papathomas |
2000-05-23 |
| 6025057 |
Organic electronic package and method of applying palladium-tin seed layer thereto |
Anastasios Angelopoulos, Gerald W. Jones, Richard William Malek, Jeffrey McKeveny |
2000-02-15 |
| 5866237 |
Organic electronic package and method of applying palladium-tin seed layer thereto |
Anastasios Angelopoulos, Gerald W. Jones, Richard William Malek, Jeffrey McKeveny |
1999-02-02 |
