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Accelerated cooling process for reactors |
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2022-09-13 |
| 7294565 |
Method of fabricating a wire bond pad with Ni/Au metallization |
Lloyd Burrell, Ronald D. Goldblatt, William Francis Landers, Sanjay C. Mehta |
2007-11-13 |
| 7098676 |
Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor |
William Francis Landers, Thomas M. Shaw, Diana Llera-Hurlburt, Scott W. Crowder, Vincent J. McGahay +3 more |
2006-08-29 |
| 7009280 |
Low-k interlevel dielectric layer (ILD) |
Matthew S. Angyal, Edward Barth, Sanjit Das, Habib Hichri, William Francis Landers +1 more |
2006-03-07 |
| 6815346 |
Unique feature design enabling structural integrity for advanced low k semiconductor chips |
David L. Hawken, Dae Young Jung, William Francis Landers, David L. Questad |
2004-11-09 |
| 6650010 |
Unique feature design enabling structural integrity for advanced low K semiconductor chips |
David L. Hawken, Dae Young Jung, William Francis Landers, David L. Questad |
2003-11-18 |
| 6531759 |
Alpha particle shield for integrated circuit |
Richard A. Wachnik, Henry A. Nye, III, Theodore H. Zabel, Phillip J. Restle |
2003-03-11 |
| 6486557 |
Hybrid dielectric structure for improving the stiffness of back end of the line structures |
Daniel C. Edelstein, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes, Vincent J. McGahay +1 more |
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| 5872337 |
Chip carrier and cable assembly reinforced at edges |
Donald S. Farquhar, Stephen Joseph Fuerniss, David L. Questad, Darbha Suryanarayana, Jeffrey Zimmerman |
1999-02-16 |
| 5789121 |
High density template: materials and processes for the application of conductive pastes |
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1998-08-04 |
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Method for producing multi-layer circuit board and resulting article of manufacture |
Thomas P. Gall |
1998-01-20 |
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Method for producing multi-layer circuit board and resulting article of manufacture |
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1997-10-21 |
| 5626771 |
Design of high density structures with laser etch stop |
Frank D. Egitto, Eugene R. Skarvinko |
1997-05-06 |
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Method of fabricating a flex laminate package |
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1997-04-15 |
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Design of high density structures with laser etch stop |
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1996-07-16 |
| 5509196 |
Method of fabricating a flex laminate package |
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| 5460921 |
High density pattern template: materials and processes for the application of conductive pastes |
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| 5421507 |
Au-Sn transient liquid bonding in high performance laminates |
Richard Hsiao, James R. Loomis, Jae Man Park, Jonathan D. Reid |
1995-06-06 |
| 5384690 |
Flex laminate package for a parallel processor |
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Reactive surface functionalization |
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1994-10-18 |
| 5340451 |
Process for producing a metal organic polymer combination |
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| 5280414 |
Au-Sn transient liquid bonding in high performance laminates |
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1994-01-18 |
| 5208068 |
Lamination method for coating the sidewall or filling a cavity in a substrate |
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1993-05-04 |
| 5206074 |
Adhesives on polymide films and methods of preparing them |
Ashit A. Mehta, Konstantinos I. Papathomas, Lee P. Springer, William J. Summa, David W. Wang |
1993-04-27 |
| 4787077 |
Process for optically storing information using materials having a single phase in both the crystalline state and the amorphous state |
Roger W. Barton, Martin Chen, Grace Gorman, Vincent Marrello, Kurt A. Rubin |
1988-11-22 |
