FE

Frank D. Egitto

IBM: 58 patents #1,384 of 70,183Top 2%
ET Endicott Interconnect Technologies: 26 patents #4 of 87Top 5%
Applied Materials: 2 patents #3,641 of 7,310Top 50%
Overall (All Time): #18,885 of 4,157,543Top 1%
88
Patents All Time

Issued Patents All Time

Showing 25 most recent of 88 patents

Patent #TitleCo-InventorsDate
9351408 Coreless layer buildup structure with LGA and joining layer Voya R. Markovich, Timothy Antesberger, William E. Wilson, Rabindra N. Das 2016-05-24
8607445 Substrate having internal capacitor and method of making same Rabindra N. Das, John M. Lauffer, How T. Lin 2013-12-17
8558374 Electronic package with thermal interposer and method of making same Voya R. Markovich, Rabindra N. Das, James J. McNamara, Jr. 2013-10-15
8541687 Coreless layer buildup structure Voya R. Markovich, Timothy Antesberger, William E. Wilson, Rabindra N. Das 2013-09-24
8536459 Coreless layer buildup structure with LGA Voya R. Markovich, Timothy Antesberger, William E. Wilson, Rabindra N. Das 2013-09-17
8499445 Method of forming an electrically conductive printed line Rabindra N. Das, Voya R. Markovich 2013-08-06
8501575 Method of forming multilayer capacitors in a printed circuit substrate Rabindra N. Das, How T. Lin, John M. Lauffer, Voya R. Markovich 2013-08-06
8405229 Electronic package including high density interposer and circuitized substrate assembly utilizing same Timothy Antesberger, Voya R. Markovich, William E. Wilson 2013-03-26
8245392 Method of making high density interposer and electronic package utilizing same Timothy Antesberger, Voya R. Markovich, William E. Wilson 2012-08-21
8240031 Method of joining a semiconductor device/chip to a printed wiring board Voya R. Markovich, Ronald V. Smith, How T. Lin, Rabindra N. Das, William E. Wilson +1 more 2012-08-14
8240027 Method of making circuitized substrates having film resistors as part thereof John S. Kresge, John M. Lauffer 2012-08-14
8198739 Semi-conductor chip with compressible contact structure and electronic package utilizing same How T. Lin, Voya R. Markovich 2012-06-12
7981245 Multi-layered interconnect structure using liquid crystalline polymer dielectric Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell 2011-07-19
7897877 Capacitive substrate Rabindra N. Das, John M. Lauffer, How T. Lin, Voya R. Markovich 2011-03-01
7875811 High speed interposer David V. Caletka 2011-01-25
7823274 Method of making multilayered circuitized substrate assembly Voya R. Markovich, Luis J. Matienzo 2010-11-02
7803688 Capacitive substrate and method of making same Rabindra N. Das, John M. Lauffer, How T. Lin, Voya R. Markovich 2010-09-28
7800916 Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same Kim J. Blackwell, John M. Lauffer, Voya R. Markovich 2010-09-21
7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell 2010-08-17
7738249 Circuitized substrate with internal cooling structure and electrical assembly utilizing same Benson Chan, How T. Lin, Roy H. Magnuson, Voya R. Markovich, David L. Thomas 2010-06-15
7679005 Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same Benson Chan, Roy H. Magnuson, Voya R. Markovich, David L. Thomas 2010-03-16
7629541 High speed interposer David V. Caletka 2009-12-08
7596862 Method of making a circuitized substrate Kevin Knadle, Andrew Seman 2009-10-06
7511518 Method of making an interposer How T. Lin 2009-03-31
7501839 Interposer and test assembly for testing electronic devices Benson Chan, Voya R. Markovich 2009-03-10